Description

Placement Head System

Multi-Configuration Placement Architecture

• Ultra-High-Speed RS Head: Specialized for micro-components (0201 metric / 0.25×0.125mm to 6.5×6.5mm, ≤2mm height), achieving a theoretical throughput of 200,000 CPH (Yamaha benchmark conditions), ideal for high-density micro-component placement.
• Multi-Function MU Head: Handles 03015 metric (0.3×0.15mm) to 45×60mm components (≤15mm height) at 58,000 CPH, supporting complex packages (QFP, BGA) with advanced alignment capabilities.
• Odd-Form FL Head (Optional): Accommodates 0603 to 45×100mm odd-shaped components (≤25.5mm height, e.g., heat sinks, connectors), enhancing mixed-model production flexibility.
• Modular Beam Configuration:
  • YSM40R-4: 4 beams × 4 placement heads for maximum throughput
  • YSM40R-2: 2 beams × 2 placement heads for compact high-precision setups

Vision & Inspection System

High-Precision Metrology Suite

• Laser Profilometry (LNC): Real-time 3D component inspection for position, angle, and height with ±35μm accuracy (±25μm @ Cpk≥1.0), meeting IPC-9850 standards for high-density PCB assembly.
• Multi-Angle Vision Module: Employs structured light and 3D imaging to detect lead coplanarity, solder ball integrity, and component orientation, improving first-pass yield by 98%.
• Automatic Calibration Protocol: Achieves ±0.03mm repeatability for CHIP components and ±0.04mm for QFP packages via IPC-9850 traceable calibration, ensuring long-term process stability.

Feeder System

High-Density Material Handling

• RS Head Feeding Platform: Supports 80×8mm tape feeders (tube/tray compatible), optimized for small-batch, high-mix production with quick-change cassettes.
• MU/FL Head Expansion: Scalable to 88 stations (8mm tape equivalent), with optional 92-station configuration for odd-form components, enabling seamless transitions between component types.
• ZS High-Speed Feeder Technology: Enables non-stop tape changeovers via intelligent splicing, maintaining continuous production and reducing downtime to <1%.

PCB Processing System

Ultra-Wide Substrate Capability

• Standard Handling: 50×50mm–700×460mm PCBs; expandable to 700×460mm for LED panel and industrial board production.
• Active Substrate Stabilization: Auto-adjusting track width and support pin positioning minimize warpage during transport (speed up to 1,500mm/sec), ensuring ±50μm placement stability.

Motion Control System

Advanced Mechanical Design

• Linear Motor Drives with Magnetic Levitation: X/Y axes achieve sub-micron positioning (0.001mm resolution magnetic scales) and optimized acceleration profiles for vibration-free high-speed operation (up to 5G acceleration).
• Dual-Servo Y-Axis Synchronization: Ensures conveyor stability for long substrates, maintaining placement accuracy consistency across 700mm board lengths.

Software Ecosystem

VIOS Industrial Control Platform

• Offline Programming Suite: CAD-to-Gerber conversion with 3D placement simulation and dynamic path optimization, reducing changeover time to <5 minutes.
• Smart Factory Integration: Real-time OEE monitoring, mispick rate tracking, and fault code diagnostics via IPC-CFX/SECS-GEM protocols, enabling seamless MES/ERP integration.
• Predictive Maintenance IoT: Real-time sensor data on head health, feeder wear, and thermal drift, with proactive alerts to minimize unscheduled downtime by 75%.