Description

 Mounting head system
Multi-type mounting head configuration:
Ultra-high-speed RS mounting head: supports 0201 (0.25×0.125mm) to 6.5×6.5mm components (height ≤2mm), with a theoretical mounting speed of 200,000 CPH (under Yamaha’s best conditions), suitable for high-speed mounting of micro components.
Multi-function MU mounting head: handles 03015 (0.3×0.15mm) to 45×60mm components (height ≤15mm), with a speed of 58,000 CPH, and supports complex packages such as QFP and BGA.
Odd-shape FL mounting head (optional): supports 0603 to 45×100mm special-shaped components (height ≤25.5mm), such as heat sinks and connectors, to enhance the flexibility of mixed production.
Modular design:
It can be configured as 4 beams and 4 placement heads (YSM40R-4) or 2 beams and 2 placement heads (YSM40R-2). Users can quickly adjust production capacity to meet different production needs.

 Vision and inspection system
High-precision visual recognition:
Laser sensor (LNC): Real-time detection of component position, angle and height, with a placement accuracy of ±35μm (±25μm @ Cpk≥1.0), meeting the needs of high-density PCB mounting.
Multi-view camera: Supports multi-angle lighting and 3D image generation, detects complex features such as pin bending and solder ball status, and improves yield.
Automatic calibration function: Achieve repeatability accuracy of ±0.03mm (CHIP component) and ±0.04mm (QFP package) through IPC9850 standard, adapting to long-term stable production.

 Feeder system
High-capacity feeding configuration:
RS placement head: supports 80 8mm tape feeders, compatible with tube-mounted and tray-mounted components, and improves the production efficiency of small batches and multiple varieties.
MU/FL placement head: expanded to 88 stations (8mm tape conversion), and up to 92 stations when equipped with special-shaped placement heads, to meet the needs of high-mix production.
New ZS high-speed feeder: supports non-stop switching and continuous production, reducing downtime.

PCB processing capacity
Ultra-large substrate compatibility: standard support for 50×50mm~700×460mm substrates, and after expansion, it can handle up to 700×460mm long substrates (such as LED light boards).
Intelligent clamping system: automatically adjusts the track width and support pin position to reduce substrate transmission deformation and improve placement stability.

 Motion control system
Linear motor drive: X/Y axis uses high-precision linear motor and magnetic suspension technology, combined with 0.001mm resolution magnetic scale, to achieve high speed (acceleration optimization) and micron-level positioning stability.
Dual servo Y-axis drive: optimizes track transmission stability and reduces vibration in long substrate placement.

Software and intelligent functions
VIOS operating system: supports offline programming (CAD import) and 3D simulation debugging, optimizes placement path, and shortens line change time to minutes.
Real-time monitoring and diagnosis: displays the throwing rate, equipment status and fault code, integrates IPC-CFX and SECS/GEM protocols, and seamlessly connects with MES/ERP systems.
Predictive maintenance: sensors monitor the health status of equipment in real time, provide maintenance warnings, and reduce the risk of unexpected downtime.