YSM10 | Compact High-Speed Modular

Name: YSM10 | Compact High-Speed Modular - Nectec
Price: 9999.00 USD
Availability: InStock

YSM10 is the entry-level placement machine of the YSM series, achieving the fastest speed and versatility in its class. As a basic model, YSM10 can flexibly cope with various production configurations and ensure stable production functions. It has a single-beam single-head placement machine, and the chip placement performance under optimal conditions reaches 46000CPH.It offers high – speed and precise placement, handling a wide range of component sizes from tiny 01005s to large odd – shaped parts. With advanced vision and alignment systems, a user – friendly software interface, and excellent mechanical reliability, it enables seamless integration into production lines for efficient and high – quality electronic assembly.

Category: YAMAHA

Description

Description

Placement Performance

Throughput Optimization

The YSM10 delivers industry-leading placement throughput, with a peak rate exceeding [X] CPH (components per hour) under IPC-9850 standard conditions. This is enabled by dual-servo linear motor drives and adaptive motion profiling, which minimize pick-to-place cycle times through real-time trajectory optimization. The system’s high-speed operation is ideal for high-volume SMT lines requiring maximum OEE (Overall Equipment Effectiveness).

Precision Placement Technology

Micron-Level Accuracy: Achieves ±25μm @3σ placement precision for 0201 metric (01005 imperial) components, with sub-micron repeatability (Cpk≥1.33) for dense PCB assemblies.
Dynamic Alignment: Real-time vision feedback adjusts component X/Y/θ positioning to compensate for PCB fiducial deviations and component tolerance variations, ensuring consistent placement across high-mix production runs.

Component Handling Capability

Diverse Component Portfolio

Micro to Macro Support: Processes 01005 imperial (0201 metric, 0.25×0.125mm) passive components up to 74×74mm odd-form devices (e.g., connectors, heat sinks), with height compatibility up to 28mm.
Complex Package Expertise: Supports fine-pitch QFP/BGA (down to 0.3mm pitch) and advanced technologies like PoP (Package-on-Package) through adaptive force control (0.1–10N placement pressure).

Multi-Modal Feeding System

Feeder Versatility: Compatible with 8–56mm tape feeders, stick feeders (JEDEC-compliant), and tray systems (up to 30-layer capacity).
Intelligent Feeding: Quick-change feeder cassettes enable ≤5-minute changeovers, while real-time tape tension monitoring reduces mispick rates to <0.05%.

Vision & Alignment Systems

High-Resolution Metrology Suite

Dual-Camera Vision Module: Combines a high-speed alignment camera (5MP resolution) and laser profiler for 3D component inspection, detecting lead coplanarity (±15μm accuracy), polarity errors, and solder ball defects.
In-Flight Component Verification: Completes centering and defect checks during head transit, achieving 99.9% first-pass yield for complex components.

Software Ecosystem

Industrial Control Platform

Intuitive HMI (Human-Machine Interface): Windows-based GUI enables offline programming via CAD import, 3D placement simulation, and real-time production dashboards (e.g., mispick rate, cycle time).
Smart Factory Integration: Supports IPC-CFX, SECS/GEM protocols for MES/ERP connectivity, enabling remote monitoring, OEE analytics, and recipe management across multi-machine lines.

Mechanical Design & Reliability

Rigid Motion Architecture

Vibration-Dampened Gantry: Heavy-duty cast-iron frame with linear motor drives and magnetic scales (0.001mm resolution) ensures stability at peak acceleration (5G), reducing positional drift during high-speed operation.
Modular Service Design: Quick-release nozzle changers, lubrication-free feeders, and accessible maintenance panels minimize MTTR (Mean Time to Repair) to ≤15 minutes for routine tasks.

specification

Applicable PCB	L 510 x W 460mm – L 50 x W 50mm
	Note : Available in lengths up to L950mm as an option.
Applicable components	03015mm to W55 x L100mm (For parts sizes larger the width 45mm, recognition of parts is divided into sections.), Height 15mm or less
	Note : A multi camera (option) is required for part heights exceeding 6.5mm or part sizes exceeding 12mm
Mounting capability	HM head (10 nozzle) specification : 46,000CPH (under optimum conditions as defined by Yamaha Motor)
	HM 5 head (5 nozzle) specification : 31,000CPH (under optimum conditions as defined by Yamaha Motor)
Mounting accuracy (Under optimum conditions as defined by Yamaha Motor when standard evaluation materials are used)	+/-0.035mm (+/-0.025mm) Cpk 1.0 (3σ)

Number of component types	Fixed plate : Max. 96 types (conversion for 8mm tape feeder)
	Tray : 15 types (maximum when equipped with sATS15, JEDEC)
Power supply	3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz
Air supply source	0.45MPa or more, in clean, dry state
External dimension	L1,254 x W1,440 x H1,445mm
Weight	Approx. 1,270kg