Description

Placement head system
High-speed rotary head (RM head): adopts new rotary head technology, equipped with 18 nozzles, supports 0201 (0.25×0.125mm) to 12×12mm components, and the theoretical placement speed reaches 115,000 CPH (under optimal conditions), which is suitable for high-speed placement of microchips.
Sigma technology optimization: reduce the impact of thermal deformation and ensure the placement accuracy of ±25μm (Cpk≥1.0).
In-line multifunctional head (HM head): equipped with 10 nozzles, supports 55×100mm large components (maximum height 15mm), and the placement speed reaches 98,000 CPH, achieving a balance between high speed and high compatibility.
Servo system upgrade: dynamic pressure control range is wider (0.1N~100N), adapting to the stable placement of special-shaped components (such as connectors and heat sinks).

 Feeder system
High-capacity feeder configuration: supports 128 component types, compatible with 8mm to 56mm electric belt feeders, adopts batch exchange material cart design (32 stations × 4 groups) to improve line change efficiency.
New high-speed feeder: improves the material belt supply speed, reduces the waiting time for component picking, and optimizes production efficiency.

Vision and inspection system
Multi-mode recognition technology: Online image recognition camera: supports regional image and linear image switching, flexibly responds to pin and polarity detection of complex components (such as BGA, QFP), and improves recognition accuracy.
Laser sensor (LNC): real-time monitoring of component height and position, reducing placement errors caused by nozzle wear or contamination.

 PCB processing capabilities
Large-size substrate support: standard substrate size 50×50mm~810×510mm, supports dual-track transmission mode, and can be expanded to a maximum of 1,200×510mm long substrate (suitable for scenes such as LED light boards).
Overspeed transmission technology: optimize substrate transmission speed, shorten replacement time, and improve continuous operation efficiency of production lines.

Motion control system
Linear motor drive: X/Y axis adopts high-precision linear motor and magnetic suspension technology, combined with 0.001mm resolution magnetic ruler, to achieve micron-level positioning stability under high-speed motion.
Dual servo Y-axis drive: reduce track vibration and ensure the accuracy consistency of long substrate placement.

 Intelligent software and operation interface
New GUI interface: The operation interface is redesigned to support intuitive graphical control, simplify parameter setting and program debugging process, and lower the operation threshold.
Offline programming and simulation: optimize the placement path through CAD data import, shorten the line change time to minutes, and improve the flexibility of the production line.
M2M solution: integrated traceability function, record the full process data of components from feeding to placement, support fast analysis of defective products and process improvement.