Description

Placement Head System

High-Speed Turret Head (RM Head)

• 18-Nozzle Turret Architecture: Leverages advanced rotary head technology to handle 0201 metric (0.25×0.125mm) to 12×12mm components with a theoretical placement speed of 115,000 CPH under ideal conditions, optimized for ultra-small chip high-speed placement.
• Thermal Compensation Algorithms: Minimizes thermal deformation effects, ensuring ±25μm placement accuracy (Cpk≥1.0) for stable micro-component assembly.

In-Line Multi-Function Head (HM Head)

• 10-Nozzle Universal Module: Supports 55×100mm large components (≤15mm height) at 98,000 CPH, balancing high-speed performance with broad component compatibility (e.g., connectors, heat sinks).
• Advanced Servo Control: Expanded dynamic pressure range (0.1–100N) enables stable placement of odd-form components via adaptive force modulation.

Feeder System

High-Density Feeding Platform

• 128-Station Feeder Bank: Supports 8–56mm electric tape feeders, with modular batch change trolleys (32 stations × 4 carts) for ≤5-minute changeovers in high-mix environments.
• High-Throughput Feeders: Enhanced tape advancement speed reduces component pickup latency, optimizing overall production tact time.

Vision & Inspection System

Multi-Sensor Vision Module

• Adaptive Imaging Technology: In-line vision camera switches between area and line scan modes, enabling precise lead/polarity inspection for complex packages (BGA, QFP) with ±30μm accuracy.
• Laser Profilometry (LNC): Real-time component height/position monitoring compensates for nozzle wear/contamination, reducing misplacement errors by 95%.

PCB Processing Capability

Large-Format Substrate Handling

• Dual-Lane Conveyor Configuration:
  • Standard: 50×50–810×510mm PCBs
  • Extended: Up to 1,200×510mm for LED panel and long-board applications
• High-Velocity Conveyor System: Optimized transport speed (up to 1,200mm/sec) with auto-width adjustment minimizes changeover time for continuous production.

Motion Control System

Precision Drive Technology

• Linear Motor Drives with Magnetic Levitation: X/Y axes achieve sub-micron stability (0.001mm resolution magnetic scales) at high speeds, ensuring ±15μm placement repeatability.
• Dual-Servo Y-Axis Stabilization: Reduces conveyor vibration for long substrates, maintaining positional consistency across 1,200mm board lengths.

Intelligent Software & HMI

Redesigned Human-Machine Interface

• Graphical Programming Suite: Intuitive HMI supports drag-and-drop parameter adjustment and 3D placement simulation, lowering operator training thresholds.
• Offline Programming Workflow: CAD data import with automatic path optimization reduces changeover time to <5 minutes, enhancing line flexibility.
• Machine-to-Machine Connectivity: End-to-end traceability records component journey from feeder to placement, enabling rapid defect analysis and process optimization via MES integration.