Description

Mounting head system
Multi-nozzle design: Two mounting head configurations, 6 nozzles and 3 nozzles, are provided, which support quick replacement to meet different production needs (such as mixed mounting of chip components and large ICs). The front and rear mounting heads are designed to work interactively to reduce motion loss, and the theoretical mounting speed reaches 42,000 CPH (chip components) and 14,000 CPH (IC components) (based on IPC9850 standard).
Support dynamic pressure control (0.5N~50N) to meet the mounting needs of sensitive components (such as LEDs) and PoP (stacked packages).
Laser recognition system (LNC): Covers 0402 (British 01005) to 33.5mm square components, with an accuracy of ±0.04mm (Cpk≥1), and real-time monitoring of component position and height.
Image recognition (MNVC module): supports 3mm~100mm square components and 50×180mm special-shaped components (such as long connectors), with an accuracy of ±0.03mm (requires optional high-resolution camera).

Feeder system
High-compatibility feeder: standard electric dual-track belt feeder (RF Feeder), supports 8mm to 56mm belts, with a maximum capacity of 160 components (calculated based on 8mm belt), compatible with tube and tray components.
Smart Feeder technology: automatic material connection and material shortage warning functions, reducing manual intervention and improving production continuity.

PCB processing system
Substrate compatibility: Standard substrates: single track supports 50×50mm~610×590mm, dual track supports 50×50mm~360×250mm.
Extension options: through two times clamping, it supports up to 905×590mm long substrates, suitable for large-size PCB production such as LED light boards.
Motor-driven support table: Reduce transmission vibration, shorten substrate fixing time, and improve mounting stability.

Vision and inspection system
Flying vision (On-the-fly): Complete component recognition while the mounting head is moving, reduce downtime, and optimize mounting efficiency.
Suction/mounting monitor: Standard function, real-time capture of component suction and mounting moments, prevent defective products from flowing out, and support rapid fault diagnosis.
3D inspection (optional): Detect component coplanarity and height deviation to prevent cold soldering or tombstone defects.

Motion control system
Linear motor drive: X/Y axis uses high-precision linear motor and magnetic suspension technology, combined with 0.001mm resolution magnetic scale to ensure stability under high-speed movement.
Dual servo Y-axis drive: Optimize track transmission, reduce mechanical vibration, and improve mounting consistency.

: Intelligent software and scalability JaNets production management system

Supports offline programming (CAD import), path optimization and simulation debugging, and shortens line change time.

Modular design: Expandable matrix tray server TR8S improves the processing capacity of special-shaped components.
Supports combination with other JUKI models (such as RX-7) to build a flexible production line.