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NX-E1 | Electronics X-ray Inspection System
The NX-E1 machine is designed for detecting welding defects in electronic components. It specializes in inspecting PCB, SMT assembly, IC packaging, BGA, CSP, semiconductors, etc. Equipped with a sealed X - ray tube (90kV, 200uA) and 85um pixel FPD, it achieves 5um detail resolution for precise defect identification.
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NX-E1L | Electronics X-ray Inspection System
The NX-E1L machine serves semiconductor, SMT, DIP, electronic components, IC, BGA, CSP, and flip chip X - ray detection. It has a high - resolution FPD for high - quality images to detect minimum 2um defects, uses CNC programming for automatic positioning with 45° tilt detection, offers real - time navigation imaging and HDR enhancement, and provides measurement tools like size, area, angle, and curvature.
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NX-E3 | Electronics X-ray Inspection
The X - Ray machine NX-E3 features a strong - penetrating ray source and HD FPD for universal inspection. With a 70° - tilting detector, 360° - rotating stage, and six - axis linkage for all - round control/detection, it has high - definition navigation images for fast product positioning, plus HDR enhancement and measurement tools like size/area/angular curvature.
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NX-E3L | Electronics X-ray Inspection System
The NX-E3L machine serves semiconductor, SMT, DIP, electronic components, IC, BGA, CSP, and flip chip X - ray detection. It has a high - resolution FPD for high - quality images to detect minimum 2um defects, uses CNC programming for automatic positioning with 45° tilt detection, offers real - time navigation imaging and HDR enhancement, and provides measurement tools like size, area, angle, and curvature.
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NX-E6LP | Automatic Inline X-ray Inspection System
The X-Ray machine NX-E6LP is used for detecting BGA and chip compon-ents; Nickel plate detection of metal plate andFPC welding parts, calculation of bubble perc.entage, size, area measurement, analysis ofinternal defects such as low tin and virtual soldering in products.The advanced inspection equipment is specifically designed for detecting BGA and chip components, nickel plate detection on metal plates, and FPC welding parts. It efficiently calculates bubble percentages, measures size and area, and analyzes internal defects such as low tin and virtual soldering in products.
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NX-EF | Electronics X-ray Inspection System
The NX-EF machine is applied to detect welding defects in electronic components. It is capable of inspecting PCB, SMT assembly, IC packaging, BGA (Ball Grid Array), CSP (Chip Scale Package), semiconductor and other components. With its advanced technology, it can accurately identify various welding issues, ensuring the quality and reliability of electronic products.
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NX-M1 | Casting X-ray Inspection System
Discover our advanced non-destructive testing equipment NX-M5 designed for various lightweight flat plate products, including gold and Li castings, auto parts, plastic products, and rubber products. Engineered for precision and cost-effectiveness, our inspection solutions offer high integration and space-saving design.
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NX-M2 | Casting X-ray Inspection System
The equipment NX-M2 can experience state-of-the-art detection technology with our equipment designed for small and medium-sized products such as metal castings, welding parts, hardware products, plastic products, rubber products, and ceramic bodies. This advanced system offers precise, intelligent, and automated inspection capabilities.
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NX-M5 | Casting X-ray Inspection System
Explore our versatile non-destructive testing equipment NX-M5, ideal for auto parts, casting, welds, aerospace components, and related industries. Designed to meet the diverse inspection needs of small to medium workpieces, thin-walled light workpieces, and thick gray cast iron, this equipment ensures precise and reliable detection of various defects in tires, wheels, and other castings, maintaining product quality and safety.
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NX-M5C | In-line Casting X-ray Inspection System
The on-line X-ray inspection machine NX-M5C is used for automatic inspection of auto parts: The automatic optical inspection andscreening instrument developed on the basis of image detection technology system uses X-ray perspective to convert visiblelight images and uses dry Meg network to quickly input the image information of the workpiece to the pc host computer forhigh-definition imaging, automatic positioning and image processing. For pores and cracks in the image, the area and proportion of defects are automatically calculated through the measurement function to determine qualified or defective products.
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NX-MT | Casting X-ray Inspection System
Discover our cutting-edge non-destructive testing equipment NX-MT designed for detecting bubbles, pores, and foreign bodies in automobile steering wheels and various small castings. This advanced system ensures precise and reliable inspection to maintain high product quality and safety.
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NXT-H | High Accuracy Mounter
NXT-H is a high-end model designed by FUJI for semiconductor and high-density placement scenarios. Its core advantages lie in full compatibility with wafers/reel materials/trays, high-precision low-impact placement, and clean room adaptability. Its modular design combines advanced vision and pressure control technology, making it suitable for complex processes such as SiP modules, power semiconductors, and micro LEDs. It also achieves efficient production management and quality traceability through intelligent software.
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