NXT-H | High Accuracy Mounter

Name: NXT-H | High Accuracy Mounter - Nectec
Price: 9999.00 USD
Availability: InStock

NXT-H is a high-end model designed by FUJI for semiconductor and high-density placement scenarios. Its core advantages lie in full compatibility with wafers/reel materials/trays, high-precision low-impact placement, and clean room adaptability. Its modular design combines advanced vision and pressure control technology, making it suitable for complex processes such as SiP modules, power semiconductors, and micro LEDs. It also achieves efficient production management and quality traceability through intelligent software.

Category: FUJI

Description

Description

1. High-Precision Placement Head System

Multi-Source Component Handling

Supports direct pickup from wafers, tape reels, and trays, accommodating semiconductor dies (e.g., SiP modules), 0402 micro-components, and 74×74mm to 32×180mm odd-shaped components.

Adaptive Force Control: Advanced pressure modulation (e.g., H01 head: 2.2–9.8N placement force adjustment) minimizes impact on wafers and flexible PCBs, preventing component damage or substrate warpage.
High-Rigidity Mechanics: Linear motor-driven XY axes with high-resolution vision enable ±30μm positional accuracy (Cpk≥1.0) for leaded components, meeting semiconductor-grade precision.
Throughput: Achieves 16,500 CPH for 0603 chips (M3S module, H12S head), optimized for high-density placement.

2. Vision & Alignment System

Dual-Mode Inspection Architecture

Standard Vision Module: Inspects component geometry and polarity for 0402 (01005) to 74×74mm parts, with real-time posture correction.
Angled Illumination Camera (Optional): Multi-angle lighting enhances pin coplanarity detection for QFP/BGA components, mitigating cold solder risks.
Fiducial Mark Recognition: High-speed detection of substrate fiducials (≥0.5mm diameter) compensates for warpage/positional deviations, ensuring placement consistency.
Bare Die Handling: Enables direct wafer pickup of bump components using specialized nozzles (φ0.3–φ20.0mm) with vacuum adsorption control for stable pickup of ≤0.1mm-thin components.

3. Flexible Feeding Ecosystem

Multi-Format Feeder Platform

Powered Tape Feeders: Compatible with 8–88mm tape (7/13/15-inch reels); M6(S) module supports 45×8mm feeder stations.
JEDEC Tray Handling:
- Tray Unit-L: Processes 335×330mm large trays (6 components/tray).
- Tray Unit-M: Handles 135.9×322.6mm small trays (10 components/tray).
Wafer Processing Unit (MWU12i-Compatible): Integrated wafer stage supports 2–12-inch wafers with Wafer Map data management (requires specialized software).
Intelligent Material Management: Fujitrax-linked real-time consumption tracking with auto-replenishment alerts reduces downtime; batch change trolleys enable sub-minute feeder changeovers.

4. Motion Control & Modular Design

High-Performance Mechanics

Modular Architecture: 2M/4M base configurations; M6(S) module (650mm width) with dual-track conveyor processes two 360×250mm substrates simultaneously, optimizing UPH per square meter.
Cleanroom Compliance: Dust-sealed XY axes with HEPA filtration (standard), supporting ISO Class 6 (Class 1000) environments for semiconductor manufacturing.
Multi-Axis Precision:
- Z-axis: 0.1mm height resolution
- θ-axis: ±0.01° rotational adjustment for fine component alignment
Dual-Track Conveyor: Single-track mode supports up to 534×610mm substrates; motorized width adjustment in dual-track mode enhances small-board throughput.

5. Software & Automation Interface

Integrated Software Suite

Fuji Flexa Platform: Enables offline programming, multi-machine data sharing, and CAD-driven placement path optimization to reduce programming complexity.
Fujitrax Traceability: Records component-level placement data (position, force, timestamp) with PCB 2D code scanning for end-to-end quality traceability.
User Interface: 15″ GUI touchscreen with multi-language support (incl. English) for real-time status monitoring, parameter configuration, and fault diagnostics.
Auto-Calibration: One-button trigger for post-head/nozzle change calibration ensures placement accuracy consistency without manual intervention.

6. Environmental & Safety Systems

Controlled Production Environment

HEPA Filtration Module: Optional high-efficiency air filtration maintains Class 1000 cleanliness to prevent particulate contamination of semiconductor components.
Hermetic Enclosure: Reduces external contaminant ingress, suitable for high-purity applications (e.g., LED, MEMS fabrication).
Safety Compliance: Dual interlock safety doors prevent access to moving parts, meeting CE/UL standards; sensor-based nozzle wear/feeder fault monitoring generates proactive maintenance schedules.

specification

Specifications				type FC	type SD	type LD
Heads				G04FQ	H24S / H24G	H08MQ
a a	Placement accuracy *1			±0.008 mm	±0.020 mm	±0.015 mm
	Die size *2			0.5×0.5 to 15x 15 mm	0.5x 0.5 to 5.0x 5.0 mm	0.5x 0.5 to 24 x 24 mm
	Die thickness			0.08 to 6.5 mm	0.08 to 3 mm	0.08 to 6.5 mm
	Minimum bump size			0.050 mm	–	–
	Bump pitch			0.100 mm	–	–
	Throughput *1	NXT-H	Face-up	4,500 cph	13,400 cph	8,700 cph
			Face-down	6,100 cph	–	–
				4,000 cph *3	–	–
	Wafer size			4 to 12 inch
	Wafer magazine			25 or 13 slots
a w s	Placement accuracy *1			±0.008 mm	±0.020 mm	±0.015 mm
	Part sizes			0402 (01005″) to 15 x 15 mm	0.2 x0.2 to 5.0 x 5.0 mm	0603 (0201″) to 24 x 24 mm
	Throughput *1		NXT-H	5,200 cph	26,300 cph	11,500 cph
Panel sizes (Lx W)			NXT-H	48 x 48 to 610 x 380 mm
			NXT-Hw	48 x 48 to 610 x 610 mm
Power				3-phase AC200 to 230 V ±10% (50/60 Hz)
Air				0.5 MPa (ANR)
Air consumption				20 L/min (ANR)*4
Weight			NXT-H+MWU12i	1,930 kg*5	1,910 kg	1,910 kg
1 Under optimum Fuji conditions.. 2 Please consult us if it is necessary to support 0.5 x 0.5 mm or less or thickness of 0.1 mm or less. 3 Includes the flux dipping process 4 Add +90 L/min when using an MWU12i. *5 When the configuration is NXT-H +MWU12i-FC.