NXT-III | Multi-Functional Modular Placing Machine

Name: NXT-III | Multi-Functional Modular Placing Machine - Nectec
Price: 9999.00 USD
Availability: InStock

NXT-3 is a modular placement machine designed by FUJI for multi-variety and high-mix production scenarios. Its core advantages lie in flexible modular architecture, high-precision low-impact placement and intelligent production management. It supports the full range of processing from ultra-small chips to large special-shaped components, combined with advanced visual inspection and error-proofing technology, and is suitable for automotive electronics, mobile devices, semiconductor packaging and other fields with extremely high requirements for precision and efficiency. Through deep integration of software and hardware, it achieves fast changeover, efficient production and full-process quality traceability, and is one of the core equipment of intelligent factories.

Category: FUJI

Description

Description

1. Modular Architecture & Flexible Configuration

Dual Module Design

Offers M3(S) (325mm width) and M6(S) (650mm width) modules for scalable combinations, accommodating small high-density PCBs to large odd-form component production.

Rapid Head Changeover: Supports one-click placement head replacement (7 options including H12S/H08 high-speed heads, F04 precision head, and OF press-fit head), with auto-calibration triggering post-replacement to eliminate manual adjustment and reduce changeover time.
Expandable Base System: 2M/4M base platforms support up to 32 M3(S)-equivalent modules, enabling capacity scaling from prototyping to mass production.
Unit-Level Maintenance: Offline servicing of feeders, tray units, and heads without production interruption, enhancing overall equipment effectiveness (OEE).
Ergonomic Layout: Single-side operation design optimizes U-shaped/back-to-back line configurations, minimizing operator movement.

2. High-Precision Placement Heads

Multi-Head Portfolio

H12S/H08 High-Speed Heads: Handle 0402 (01005) to 7.5×7.5mm components at 16,500 CPH (M3S module), ideal for high-density micro-component placement.
H01/F04 Precision Heads: Accommodate large odd-form components (up to 74×74mm/32×180mm) with press-fit capability (39.2–98N force control) for connectors and power modules.
Low-Impact Technology: Standard nozzles with ≤50gf impact force and adaptive Z-axis control protect thin PCBs (≥0.3mm) and flex circuits from damage.
In-Line Post-Pick Inspection: Integrated vision (standard/angled lighting) detects component positional/rotational 偏差 (θ ≤0.1°), achieving ±30μm accuracy (leaded components, Cpk≥1.0) for 0201 (008004) ultra-micro components.
3D Coplanarity Scanning: Pre-placement BGA/CSP solder ball height verification (±20μm accuracy) rejects non-conforming components and prevents post-placement defects.

3. Intelligent Feeding & Material Logistics

Diversified Feeding Platform

Mixed Feeding Capability:
- Powered Tape Feeders: Support 8–88mm tape (7/13/15-inch reels); M6(S) holds 45×8mm feeder stations with in-production quick changeover.
- JEDEC Tray Units:
  - Tray Unit-L: Processes 335×330mm trays (6 components/tray) for semiconductor wafer-level packaging.
  - Tray Unit-M: Handles 135.9×322.6mm trays (10 components/tray) and 2–12-inch wafers.
Autonomous Material Management:
- Fujitrax-integrated real-time consumption tracking with pre-warning (3-minute lead time) and backup feeder auto-switching for non-stop production.
- Batch feeder trolley enables 50% faster changeovers (e.g., 45-station M6(S) module swaps) with automatic pin-position calibration.
Universal Nozzle Design: Compatible with 0603/1005/1608/2125 components, reducing nozzle change frequency.

4. Vision Systems & Quality Assurance

Metrology-Grade Inspection

Fiducial Mark Recognition: 0.25s/fiducial read speed with laser-based substrate warpage compensation (±0.1mm accuracy) ensures placement consistency on warped substrates (≤±0.5mm).
Intelligent Part Sensor (IPS):
- Pre-placement: Detects missing components, tombstoning, polarity errors, and performs LCR electrical testing on passive components.
- Post-placement: Residual component verification to prevent double placement.
Lead Coplanarity Inspection: Angled vision inspection for QFP/SOIC leads (±30μm accuracy) mitigates solder joint defects.

5. Motion Control & Mechanical Design

High-Performance Mechanics

Linear Motor Drives: XY axes achieve ±50μm @3σ (Cpk≥1.0) positioning with ±0.01° rotational (θ) adjustment for 0.24mm fine-pitch components.
Dual-Track Conveyor:
- Single-track: Handles up to 534×610mm substrates.
- Dual-track: Processes two 360×250mm PCBs simultaneously with motorized width adjustment.
Industry-Leading Productivity Density: 1934mm compact width with modular stacking delivers 67,200 CPH/㎡ area efficiency, ideal for high-density factory layouts.
Cleanroom Compliance: Optional HEPA filtration supports ISO Class 6 (Class 1000) environments for semiconductor/MEMS applications.

6. Intelligent Software & Production Control

Integrated Software Suite

Fuji Flexa Platform: Offline CAD-to-program automation reduces setup time by 30%, with multi-machine program synchronization and version control.
Real-Time Analytics: Dynamic OEE monitoring (availability/performance/yield) and energy management with <1-minute anomaly alerts.
Fujitrax Traceability: Records 30+ parameters (placement coordinates, force, timestamp) per component, linked to PCB 2D codes for end-to-end traceability.
Error Prevention: Feeder ID authentication prevents mis-loading; one-click post-head/nozzle calibration (requiring special jigs) ensures accuracy consistency.
Predictive Maintenance: Sensor-based monitoring of nozzle wear/feeder health generates proactive maintenance schedules to minimize downtime.

specification

	M3 III		M6 III
Applicable PCB size (LxW)	48 x 48 mm to 305 x 610 mm (single conveyor)		48 x 48 mm to 610 x 610 mm (single conveyor)
	48 x 48 mm to 305 x 510 mm (double conveyor/single)		48 x 48 mm to 610 x 510 mm (double conveyor/single)
	48 x 48 mm to 305 x 280 mm (double conveyor/dual)		48 x 48 mm to 610 x 280 mm (double conveyor/dual)
Part types	Up to 20 types of parts (calculated using 8 mm tape)		Up to 45 types of parts (calculated using 8 mm tape)
PCB loading time	For double conveyor: 0 sec (continuous operation)
PCB loading time	For single conveyor: 2.5 sec (transport between M3 III modules), 3.4 sec (transport between M6 III modules)
Placement accuracy	H24G	: +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00	H24G	: +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00
(Fiducial mark standard)	V12/H12HS	: +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00	V12/H12HS	: +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00
The placing accuracy is obtained from tests conducted by Fuji.	H04S/H04SF	: +/-0.040 mm (3sigma) cpk≥1.00	H08M/H04S/H04SF	: +/-0.040 mm (3sigma) cpk≥1.00
	H08/H04	: +/-0.050 mm (3sigma) cpk≥1.00	H08/H04/OF	: +/-0.050 mm (3sigma) cpk≥1.00
	H02/H01/G04	: +/-0.030 mm (3sigma) cpk≥1.00	H02/H01/G04	: +/-0.030 mm (3sigma) cpk≥1.00
	H02F/G04F	: +/-0.025 mm (3sigma) cpk≥1.00	H02F/G04F	: +/-0.025 mm (3sigma) cpk≥1.00
	GL	: +/-0.100 mm (3sigma) cpk≥1.00	GL	: +/-0.100 mm (3sigma) cpk≥1.00
Productivity	H24G	: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)	H24G	: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)
The throughput above is based on tests conducted at Fuji.	V12	: 26,000 cph	V12	: 26,000 cph
	H12HS	: 24,500 cph	H12HS	: 24,500 cph
	H08	: 11,500 cph	H08M	: 13,000 cph
	H04	: 6,500 cph	H08	: 11,500 cph
	H04S	: 9,500 cph	H04	: 6,500 cph
	H04SF	: 10,500 cph	H04S	: 9,500 cph
	H02	: 5,500 cph	H04SF	: 10,500 cph
	H02F	: 6,700 cph	H02	: 5,500 cph
	H01	: 4,200 cph	H02F	: 6,700 cph
	G04	: 7,500 cph	H01	: 4,200 cph
	G04F	: 7,500 cph	G04	: 7,500 cph
	GL	: 16,363 dph (0.22 sec/dot)	G04F	: 7,500 cph
			0F	: 3,000 cph
			GL	: 16,363 dph (0.22 sec/dot)
Supported parts	H24G	: 0201 to 5 x 5 mm	Height	: up to 2.0 mm
	V12/H12HS	: 0402 to 7.5 x 7.5 mm	Height	: up to 3.0 mm
	H08M	: 0603 to 45 x 45 mm	Height	: up to 13.0 mm
	H08	: 0402 to 12 x 12 mm	Height	: up to 6.5 mm
	H04	: 1608 to 38 x 38 mm	Height	: up to 9.5 mm
	H04S/H04SF	: 1608 to 38 x 38 mm	Height	: up to 6.5 mm
	H02/H02F/H01/0F	: 1608 to 74 x 74 mm (32 x 180 mm)	Height	: up to 25.4 mm
	G04/G04F	:0402 to 15 x 15 mm	Height	: up to 6.5 mm
Module width	320 mm		645 mm
Machine dimensions	L: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III)
Machine dimensions	W: 1900.2 mm, H: 1476 mm

DynaHead(DX)
Nozzle quantity		12	4	1
Throughput(cph)		25,000 Parts presence function ON: 24,000	11,000	4,700
Throughput(cph)		25,000 Parts presence function ON: 24,000	11,000	4,700
Part size (mm)		0402 (01005″) to 7.5 x 7.5 Height: Up to 3.0 mm	1608 (0603″) to 15 x 15 Height: Up to 6.5 mm	1608 (0603″) to 74 x 74 (32 x 100) Height: Up to 25.4 mm



Placing accuracy (Fiducial mark based referencing)		+/-0.038 (+/-0.050) mm (3σ) cpk≥1.00*	+/-0.040 mm (3σ) cpk≥1.00	+/-0.030 mm (3σ) cpk≥1.00
		+/-0.038 mm obtained with rectangular chip placement (high
		accuracy tuning) under optimal conditions at Fuji.
Part presence check		o	x	o
Part presence check		o	x	o
Parts supply	Tape	o	o	o
	Stick	x	o	o
	Tray	x	o	o

Parts supply system
lntelligent feeders	Support for 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, and 104 mm wide tape
Stick feeders	4 ≤ Part width ≤ 15 mm (6 ≤ Stick width ≤ 18 mm), 15 ≤ Part width ≤ 32 mm (18 ≤ Stick width ≤ 36 mm)
Trays	Applicable tray size: 135.9 x 322.6 mm (JEDEC standard) (Tray Unit-M)，276 x 330 mm (Tray Unit- LT), 143 x 330 mm (Tray Unit-LTC)

Options
Tray feeders, PCU II (Pallet Change Unit), MCU (Module change unit), Engineering panel stand, FUJI CAMX Adapter, Nexim Software