Description

1. Configurable Thermal Management

   • Optional Cooling System: On-demand active cooling  mitigates thermal stress on defect boards post-inspection (AOI/SPI).

   • Document Reference: Explicitly listed as optional , contrasting with dedicated Cooling Buffer.

2. Dynamic PCB Pitch Configuration

   • 4-Step Indexing Pitch: Selectable 10/20/30/40mm spacing accommodates mixed-product lines. Validates against standard pitch options across Loader/Unloader series .

   • Critical Application: Isolates NG boards without disrupting line flow.

3. Industrial-Grade Control Interface

   • Sealed Membrane Panel: IP-rated touch interface resists flux/dust ingress. Correlates to Vertical Buffer’s robustness .

   • Operational Efficiency: Enables rapid mode switching during high-volume production.

4. Adaptive Material Flow Logic

   • FIFO/LIFO/Pass-through:

     • FIFO: Prioritizes earliest NG boards for rework.

     • LIFO: Expedites recent defect analysis.

     • Pass-through: Bypasses buffering during calibration.

   • Cross-Reference: Magazine Buffer confirms identical flow logic for defect management.

5. Precision Mechanical Adjustment

   • Lead-Screw Width Adjustment: Manual resizing for PCB widths 250–460mm. Lower precision vs. ball screw but cost-optimized.

   • Retrieval Positioning: Guided access to NG boards reduces handling time.

6. Contamination-Protected Transport

   • Enclosed Roller Transmission: Sealed pathway prevents particulate deposition during storage/retrieval. Mirrors Vertical Buffer.

   • Compact Footprint: 500–580mm width (Models BF-250N/BF-330N) minimizes cleanroom space vs. Magazine Buffer.

7. Line Integration Standards

   • SMEMA Compliance: Synchronizes error signals with AOI/SPI and MES. Consistent with all PCB Handling products.

   • Unified Transport Height: 900±20mm ensures mechanical interoperability.