Description

Placement Head System

6-Nozzle Laser Placement Module

• LNC60 Laser Metrology: Enables on-the-fly component centering with real-time position, angular, and dimensional inspection for 0402 (01005 imperial) to 33.5mm² components. Achieves ±50μm placement accuracy (Cpk≥1.0).
• Adaptive Force Control: Automatically modulates placement pressure for components up to 25mm in height, ensuring consistent force application across varied geometries.

High-Resolution Vision Head (1-Nozzle)

• MNVC Vision Module: Processes 3–74mm² components and 50×150mm odd-forms with ±30μm accuracy via continuous image recognition, boosting IC placement throughput to 9,470 CPH.

Vision & Inspection System

• Laser Profiling: Real-time component shadow analysis reduces misplacement risk for complex packages (QFP, BGA).
• MNVC High-Resolution Imaging: Standard 5MP camera with continuous frame processing optimizes high-speed IC placement.
• Optional 3D Laser Inspection: Detects component coplanarity and height deviations to prevent cold solder joints.

Feeder System

• EF08HD Dual-Track Powered Feeders: Support 8–56mm tape widths with 160-station capacity (8mm equivalent), doubling traditional feeder density.
• Smart Feeder Technology: Automates tape splicing and material shortage alerts, minimizing manual intervention.
• Hybrid Feeder Compatibility: Backward-compatible with mechanical feeders to protect legacy investments.

PCB Handling System

• Multi-Format Substrate Support:
  • Standard: L-type (410×360mm), XL-type (610×560mm)
  • Extended: Up to 1,210×560mm for LED panels and ultra-long PCBs
• Servo-Driven Support Platform: Reduces transport vibration via active damping, improving placement repeatability and fixture time.

Motion Control System

• Linear Motor Drives: X/Y axes utilize 0.001mm-resolution linear encoders with full closed-loop control for sub-micron positioning and optimized acceleration profiles.
• Dual-Servo Y-Axis Actuation: Enhances conveyor stability during high-speed operation, minimizing vibration-induced errors.

Software & Intelligent Functions

• JANETS Offline Programming: CAD-to-path conversion with dynamic trajectory optimization and simulation debugging to reduce setup time.
• Real-Time Production Monitoring: Integrated fault code library with OEE metrics (mispick rate, placement status) for MES/ERP integration.
• Modular Line Configuration: Interoperable with JUKI FX-3R series for scalable, mixed-model production lines.