Description

Placement head system
Laser placement head (6 nozzles): equipped with LNC60 laser sensor, supports on-the-fly centering recognition, can complete the detection of component position, angle and size on the move, covering 0402 (01005 British) to 33.5mm square components, with a placement accuracy of ±0.05mm (Cpk≥1).
Dynamic pressure control: automatically adjusts the placement pressure according to the component type, adapting to components of different heights (up to 25mm) and sizes. High-resolution visual placement head (1 nozzle). Supports image recognition (MNVC module), can handle 3mm to 74mm square components or 50×150mm special-shaped components, with an accuracy of ±0.03mm.

 Vision and detection system
Laser recognition: monitors component status in real time through shadow analysis, reduces the risk of missing or wrong placement, and supports complex packages such as QFP and BGA.
Image recognition (MNVC module): Standard high-resolution camera, supports continuous image recognition, and increases IC component placement speed to 9,470 CPH (when using MNVC).
Optional 3D detection module (optional) detects component height and coplanarity to prevent cold soldering.

 Feeder system
Electric dual-track feeder (EF08HD): supports 8mm to 56mm tape feeders, and can load up to 160 components (based on 8mm tape), which is double the capacity of traditional models.
Smart Feeder technology: automatic material connection and material shortage warning, reducing manual intervention and improving production continuity.
Hybrid compatibility: Both electric and mechanical feeders can be used to reduce upgrade costs.

 PCB processing system
Substrate compatibility: supports standard substrates (such as L-type 410×360mm, XL-type 610×560mm) and extended long substrates (maximum 1,210×560mm), suitable for LED light boards, displays and other ultra-long PCB production.
Motor-driven support table: Reduce vibration during substrate transmission, shorten fixing time, and improve placement accuracy.

Motion control system
Linear motor drive: X/Y axis uses high-precision linear magnetic scale (resolution 0.001mm), combined with full closed-loop control to achieve high speed (acceleration optimization) and high-precision positioning.
Dual servo Y-axis drive: Optimize track stability and reduce vibration during high-speed movement.

Software and intelligent functions
Offline programming (JANETS): Supports CAD import, path optimization and simulation, can generate programs offline and simulate debugging to improve efficiency.
Real-time monitoring and diagnosis: Built-in fault code library, real-time display of throwing rate and placement status, support integration with MES/ERP system.
Modular design: Compatible with other JUKI models (such as FX-3R), flexible configuration of production lines.