EN 
ES 
FR 
AR 
PT 
RU 
DE 
IT 
TR 
PL 
NL 
CS 
RO 
SK 
ZH 
JA 
KO 
ID 
NX-E3L | Electronics X-ray Inspection System
The NX-E3L machine serves semiconductor, SMT, DIP, electronic components, IC, BGA, CSP, and flip chip X – ray detection. It has a high – resolution FPD for high – quality images to detect minimum 2um defects, uses CNC programming for automatic positioning with 45° tilt detection, offers real – time navigation imaging and HDR enhancement, and provides measurement tools like size, area, angle, and curvature.
- Description
Description
Functions and Features
Diverse Application Coverage：Applied in semiconductor, SMT, DIP, electronic components, IC, BGA, CSP, flip chip X – ray detection scenarios.
High – Resolution Imaging：Equipped with high – resolution FPD to obtain high – quality images, capable of detecting defects as small as 2um.
Precise Automatic Positioning：Features CNC programming automatic positioning, with small opening angle (45° tilt detection) for accurate inspection.
Intelligent Image Enhancement：Supports real – time navigation imaging and has HDR image enhancement function for clearer visual presentation.
Comprehensive Measurement Tools：Provides measurement tools for size, area, angle, and curvature to meet diverse detection analysis needs.
specification
Note: The above information only represents general descriptions and characteristics, which may change with technological advancement an equipment upgrades. Specific parameters are subject to the final agreement. | ||
Item | Model | NX-E3L |
X-Ray Tube | Tube Style | Sealed tube |
Tube voltage | 90kv | |
Tube current | 0.2mA | |
Tube focus | 5um | |
Cooling mode | Air cooling | |
Geometric magnification time | 125 (times) | |
Motion Control System | Axis x | 1500mm |
Axis Y | 500mm | |
Axis Z1 | 220mm | |
Axis Z2 | 250mm | |
Flat panel detector | Pixel size | 85um |
Pixelmatrix | 1536*1536mm | |
Effective imaging area | 130*130mm | |
Spatial resolution | 5.8lp /mm | |
AD conversion digits | 16bit | |
