Σ-G5SⅡ | High-Speed Premium Modular Placement Machine

Name: Σ-G5SⅡ | High-Speed Premium Modular Placement Machine - Nectec
Price: 9999.00 USD
Availability: InStock

Yamaha Σ-G5SⅡ high-speed SMT PCB placement machine adds two new types of placement heads based on the “single placement head solution” to achieve high productivity. [Can place ultra-small 0201mm (0.25 × 0.125 mm) components and large components. ] This machine has expanded the component detection range and improved the placement quality. While increasing the internal buffer space, it reduces the feeding loss of large PCBs. It has further improved the details to improve reliability. And this machine is compatible with old models.He processed components of three different sizes, 0201, 0402 and 0603, at speeds of 80,000, 85,000 and 90,000 CPH respectively.

Category: YAMAHA

Description

Description

Placement Head System

Turret Placement Head

Single-Head Multi-Component Architecture: Achieves a theoretical placement speed of 90,000 CPH for 0603 components (single/dual-track models), representing a 20% throughput improvement over the previous Σ-G5S generation.
Direct-Drive Rotary Technology: Brushless motor-driven direct actuation minimizes mechanical transmission losses, enhancing response speed and precision. Supports 0201 (0.25×0.125mm) to 44×44mm components (≤12.7mm height) and 72×72mm large ICs (≤25.4mm height).

Feeder System

Super Loading Feeder (SL Feeder)

High-Capacity Feeding Platform: Supports 8–56mm tape feeders with 120-station capacity (8mm tape equivalent), compatible with tube/tray components. Enables seamless tape feeding without splicing, reducing downtime.
Modular Batch Change Trolley: Optimizes changeover efficiency for high-mix production via pre-loaded feeder cassettes.

Vision & Inspection System

High-Speed Coplanarity Metrology

Real-Time Lead Inspection: Detects component lead bending, polarity, and coplanarity for QFP/BGA packages with ±25μm accuracy (0201/03015 components) and ±40μm for 0603 components, improving first-pass yield.
Laser Profiling with Multi-Angle Illumination: Combines structured light and advanced image processing algorithms to track component height/position with sub-micron precision, minimizing placement errors.

PCB Processing Capabilities

Ultra-Wide Substrate Handling

Single-Track Model: Standard 50×50–610×510mm PCBs; optional expansion to 1,200×510mm for LED panel and long-board applications.
Dual-Track Model: Supports dual-track synchronous placement (610×250–50×84mm) or single-track large-format processing (610×415mm).
Smart Conveyor System: Optimizes substrate clamping and transport speed (up to 900mm/sec) with active vibration damping to prevent warpage.

Motion Control System

Linear Motor Drives

X/Y Axis Precision Mechanics: High-precision linear motors with magnetic levitation and 0.001mm-resolution magnetic scales ensure micron-level stability at high speeds.
Dual-Servo Y-Axis Synchronization: Enhances conveyor tracking for long substrates, maintaining placement accuracy consistency across extended dimensions.

Software & Intelligent Functions

VIOS Industrial OS

Advanced Programming Suite: Enables offline CAD import, 3D placement simulation, and path optimization, reducing changeover time to sub-10 minutes.
Smart Factory Connectivity: Real-time monitoring of mispick rates, equipment status, and fault codes; supports IPC-CFX and SECS/GEM protocols for seamless MES/ERP integration.
Predictive Maintenance System: Real-time sensor monitoring of equipment health with proactive maintenance alerts, minimizing unscheduled downtime risks.

specification

∑-G5SⅡ
Applicable PCB	Single lane	L610×W510 mm to L50×W50 mm (Optional: L1,200×W510 to L50×W50 mm)

	Dual lane	L610×W250 mm to L50×W84mm (dual feed) L610×W415mm (single feed)

Mounting capability	High-Speed Multi-Head×2 specifications: 90,000 CPH (single lane/dual lane)
Mounting accuracy (Under optimum conditions as defined by Yamaha Motor when standard evaluation materials are used)	High-Speed Multi (HM) Head	0201mm/03015mm: ±25μm/80,000 CPH
		0402mm: ±36 μm/85,000 CPH
		0603mm: ±40 μm/90,000 CPH
	Flexible Multi (FM) Head	±15μm
Applicable components	High-Speed Multi (HM) Head	0201mm to L44×W44×H12.7 mm or under
	Flexible Multi (FM) Head	1005mm to L72×W72×H25.4 mm or under Connector: 150×26 mm
Number of component types	120 types max. (8 mm wide tape equivalent)
Power supply	3-phase AC200V ±10%, 50/60Hz
Air supply source	0.45 to 0.69 MPa (4.6 to 7 kgf/cm²)
External dimension (excluding projections)	L 1,280 x W 2,240 x H 1,450mm
Weight	Approx. 1,800 kg