Description

Mounting head system
Turret mounting head: adopts a single-head solution, a single mounting head can support the mounting of multiple components, with a theoretical speed of 90,000 CPH(0603component)(single-track/dual-track models), which is about 20% higher than the previous generation Σ-G5S.
Rotary direct drive technology: directly driven by a brushless motor, it reduces mechanical transmission loss, improves response speed and accuracy, and supports 0201 (0.25×0.125mm) to 44×44mm components (height ≤12.7mm), and 72×72mm large ICs (height ≤25.4mm).

 Feeder system
SL feeder (Super Loading Feeder): supports 8mm to 56mm tape feeders, with a maximum capacity of 120 stations (converted to 8mm tape), compatible with tube-mounted and tray-mounted components, and realizes continuous feeding without splicing, reducing downtime.
Fast material change design: optimize the line change efficiency through batch material change car, adapt to high-mix production needs.

Vision and inspection system
High-speed coplanarity detection device: real-time detection of component pin bending, polarity and coplanarity, improve the placement yield of complex packages such as QFP and BGA, with an accuracy of ±25μm (0201/03015 components) to ±40μm (0603 components).
Laser recognition technology: combined with multi-angle lighting and image processing, it supports accurate tracking of component height and position, reducing placement errors.

PCB processing capabilities
Ultra-large substrate compatibility: Single-track model: standard support for 50×50mm~610×510mm substrates, and expansion options support 1,200×510mm long substrates (suitable for scenes such as LED light boards).
Dual-track model: supports dual-track synchronous placement, with substrate sizes of 610×250mm~50×84mm, or 610×415mm in single-track mode.
Intelligent transmission system: optimizes substrate fixation and transmission speed (up to 900mm/sec), reduces vibration and deformation.

Motion control system
Linear motor drive: X/Y axis adopts high-precision linear motor and magnetic suspension technology, combined with 0.001mm resolution magnetic ruler, to achieve micron-level positioning stability under high-speed motion.
Dual servo Y-axis drive: optimizes track transmission synchronization to ensure the accuracy consistency of long substrate placement.

Software and intelligent functions
VIOS operating system: supports offline programming (CAD import) and 3D simulation debugging, optimizes placement path, and shortens line change time to minutes.
Real-time monitoring and diagnosis: integrated throwing rate, equipment status and fault code display, supports IPC-CFX and SECS/GEM protocols, and seamlessly connects with MES/ERP systems.
Predictive maintenance: sensors monitor equipment health status in real time, provide maintenance warnings, and reduce the risk of unexpected downtime.