NX-E3L | Electronics X-ray Inspection System

The NX-E3L machine serves semiconductor, SMT, DIP, electronic components, IC, BGA, CSP, and flip chip X – ray detection. It has a high – resolution FPD for high – quality images to detect minimum 2um defects, uses CNC programming for automatic positioning with 45° tilt detection, offers real – time navigation imaging and HDR enhancement, and provides measurement tools like size, area, angle, and curvature.

Category: PCB BGA Xray

Description

Description

Functions and Features

Diverse Application Coverage：Applied in semiconductor, SMT, DIP, electronic components, IC, BGA, CSP, flip chip X – ray detection scenarios.

High – Resolution Imaging：Equipped with high – resolution FPD to obtain high – quality images, capable of detecting defects as small as 2um.

Precise Automatic Positioning：Features CNC programming automatic positioning, with small opening angle (45° tilt detection) for accurate inspection.

Intelligent Image Enhancement：Supports real – time navigation imaging and has HDR image enhancement function for clearer visual presentation.

Comprehensive Measurement Tools：Provides measurement tools for size, area, angle, and curvature to meet diverse detection analysis needs.

specification

Note: The above information only represents general descriptions and characteristics, which may change with technological advancement an equipment upgrades. Specific parameters are subject to the final agreement.
Item	Model	NX-E3L
X-Ray Tube	Tube Style	Sealed tube
	Tube voltage	90kv
	Tube current	0.2mA
	Tube focus	5um
	Cooling mode	Air cooling
	Geometric magnification time	125 (times)
Motion Control System	Axis x	1500mm
	Axis Y	500mm
	Axis Z1	220mm
	Axis Z2	250mm
Flat panel detector	Pixel size	85um
	Pixelmatrix	1536*1536mm
	Effective imaging area	130*130mm
	Spatial resolution	5.8lp /mm
	AD conversion digits	16bit