Description

Placement head system
High-speed universal integrated placement head (HM head): adopts dual cantilever configuration (X-axis dual-beam model), equipped with HM10 high-speed placement head, with a theoretical placement speed of 81,000 CPH (under Yamaha’s optimal conditions) or 95,000 CPH (under some dealer test conditions), supporting 0201 (metric 0.25×0.125mm) to 55×100mm components, with a maximum height of 15mm.
Dynamic pressure control: Automatically adjust the placement pressure according to the component type to prevent damage to precision components (such as MLCC, thin IC).
Special-shaped placement head (FM head): FM5 multi-function placement head supports 03015 (0.3×0.15mm) to 55×100mm special-shaped components (such as heat sinks, connectors), with a maximum height of 28mm, suitable for mixed placement scenarios.
θ-axis rotation control: supports ±180° rotation to ensure accurate positioning of polar components.

Vision and inspection system
High-precision identification system: Laser sensor: Real-time detection of component position, angle and height, with mounting accuracy of ±0.035mm (±0.025mm) @ Cpk≥1.0 (3σ).
Multi-vision camera: Supports pin bending detection and solder ball status analysis of complex packages (such as BGA, QFP), and can be expanded with 3D solder paste detection function after optional configuration.

Feeder system
High-capacity feeding configuration: Fixed feeder rack: supports up to 140 8mm tape feeders, compatible with tube-mounted and tray-mounted components.
One-time material changer: provides 128 stations, supports fast line change, and reduces downtime.
Automatic tray feeder: Fixed type supports 30-layer trays, and the material cart type supports 10-layer trays, which are suitable for high-mix production needs.

PCB processing capability
Compatibility of ultra-large substrates:
Dual-track models support substrates of the same width: maximum size L810×W356mm, minimum L50×W50mm. (Supports substrates of different widths: maximum expansion to L810×W662mm.)
Single-track models: Support substrate sizes from L810×W490mm to L50×W50mm, suitable for long-size PCB production such as LED light boards.
Intelligent clamping system: Automatically adjusts the track width and support pin position to reduce substrate transmission deformation and improve mounting stability.

Motion control system
Linear motor drive: X/Y axis uses high-precision linear motor and magnetic suspension technology, combined with 0.001mm resolution magnetic scale to achieve micron-level positioning under high-speed motion.
Dual servo Y-axis drive: Optimizes track transmission stability, reduces vibration, and ensures the consistency of long substrate mounting accuracy.

Software and intelligent functions
VIOS operating system: Supports offline programming (CAD import) and 3D simulation debugging, shortening line change time to minutes.
Real-time monitoring and diagnosis: Displays the material rejection rate, equipment status and fault codes, integrates IPC-CFX and SECS/GEM protocols, and seamlessly connects with MES/ERP systems.
Predictive maintenance: Sensors monitor the health status of equipment in real time, provide maintenance warnings, and reduce the risk of unexpected downtime.