Description

Mounting head system
High-speed universal mounting head (HM head): equipped with 10 mounting rods, supports 0201 (0.25×0.125mm) to 55×100mm components (maximum height 15mm), and the theoretical mounting speed reaches 95,000 CPH (dual cantilever configuration).
Dynamic pressure control: automatically adjusts the Z-axis pressure (0.1N~10N) according to the component type, adapting to the non-destructive mounting of precision components (such as MLCC, thin IC).
Special-shaped mounting head (FM head): equipped with 5 mounting rods, supports 03015 (0.3×0.15mm) to 55×100mm special-shaped components (maximum height 28mm), such as heat sinks and connectors, and the mounting speed reaches 90,000 CPH.
θ-axis rotation control: supports ±180° rotation to ensure accurate positioning of polar components.

 Vision and inspection system
High-resolution camera (VCS): supports multi-angle lighting and multiple exposures to generate 3D images, detect component pin bending, polarity and solder ball status, with an accuracy of ±0.025mm (Cpk≥1.0).
Laser sensor (LNC): Real-time tracking of component height and position to reduce placement errors caused by nozzle wear or contamination.
3D solder paste detection (optional): By laser scanning the PCB pad height, the placement pressure is optimized to prevent cold soldering or tombstone defects.

 Feeder system
High-capacity feeding configuration: Fixed feeder rack: supports up to 140 8mm tape feeders, compatible with tube-mounted and tray-mounted components.
One-time material changer: provides 128 stations, supports fast line change, and reduces downtime.
Automatic tray feeder: fixed type supports 30 layers, and the material cart type supports 10 layers, which is suitable for high-mix production needs.

 PCB processing capability
Support for ultra-large substrates: Single-track mode: supports 50×50mm~810×490mm substrates; dual-track mode (X-axis dual-beam model) supports simultaneous processing of 380×490mm dual substrates, suitable for long-sized PCBs such as LED light boards.
Intelligent clamping system: automatically adjusts the track width and support pin position to reduce deformation during substrate transmission and improve mounting stability.

 Software and intelligent functions
VIOS operating system: an intuitive Windows-based interface that supports offline programming (CAD import) and 3D simulation debugging, shortening line change time to minutes.
Real-time monitoring and diagnosis: displays the throwing rate, equipment status and fault code, integrates IPC-CFX and SECS/GEM protocols, and seamlessly connects with MES/ERP systems.
Predictive maintenance: sensors monitor the health status of equipment in real time, provide maintenance warnings, and reduce the risk of unexpected downtime.