Description

Placement head system
Multi-function placement head configuration
RM ultra-high-speed turret placement head (18 nozzles), placement capacity: maximum placement speed 120,000 CPH (optimal conditions, for 0201mm ultra-small chips), supporting component range 0201mm~12×12mm×6.5mm (height), covering small resistors and capacitors to medium-sized special-shaped components.
Technical features: The turret design realizes high-speed rotation pickup, and the integrated scanning camera detects the component posture in real time, and can cope with high-density placement of ultra-small components without replacing the placement head.
HM high-speed universal in-line placement head (10 nozzles), placement capacity: placement speed 100,000 CPH (chip type), supporting component range 0201mm~55×100mm×15mm (height), compatible with BGA, CSP, connectors and other special-shaped components.
Intelligent optimization: The head integrates a scanning camera to automatically identify the component position and dynamically plan the path, reducing the idle time and improving the efficiency of mounting medium and large components.
FM special-shaped component inline mounting head (5 nozzles), mounting capacity: supports 03015mm ultra-micro components ~ 55×100mm×30mm (height) large components, equipped with force control function, which can accurately control the mounting pressure and adapt to plug-in components with high precision requirements (such as connectors).
Unified mounting head solution: It can cover 0201mm ultra-small to 100mm large components without changing the mounting head, reducing the changeover time, improving production flexibility, and adapting to mixed production of multiple varieties.

 Feeder system
Multi-type feeding support
Reel feeding: The fixed feeder rack supports 128 components (8mm tape conversion), is compatible with 8-56mm pneumatic tape (F1/F2) and 8-88mm electric tape (F3), supports automatic loading (AutoLoading Feeder), and shortens the material change time by 30%. The electric smart feeder (ZS/SS series) is fully compatible with the YS series, supports continuous feeding and offline pre-setting, and reduces manual intervention.
Tray feeding (optional): Equipped with eATS30 automatic tray replacement unit, supports 30-layer JEDEC standard trays, realizes uninterrupted feeding of tray components, and is suitable for high-frequency changeover scenarios.
Rod feeding: Supports single-rod feeder, suitable for manual or automatic feeding of special-shaped components (such as connectors and heat sinks).
Flexibility and compatibility: Supports 4 sets of material change trolleys (CFB-45E, etc.), mixed use of new and old trolleys, with a maximum capacity of 128 components (8mm conversion), meeting the needs of multi-variety production.

PCB processing system
Substrate size and transmission, size range:
Single track mode: 50×50mm ~ 810×510mm (length × width), suitable for large industrial circuit boards;
Dual track mode: 50×50mm ~ 810×330mm (length × width), supports dual-track parallel production of different or the same substrates.
Transmission and positioning: The maximum transmission speed is 900mm/sec, equipped with a laser sensor to automatically adjust the transmission width, without mechanical stops, and compatible with cutouts or special-shaped substrates.
The substrate is fixed with a front reference + clamping unit, with a positioning accuracy of ±0.1mm, ensuring stability and no offset during placement.
Dual-track production mode
Parallel mode: Dual-track production of different substrates (such as mobile phone motherboard + automotive circuit board) to improve equipment utilization;
Alternating mode: Dual-track production of the same substrate to double production capacity;
Mixed mode: Flexible combination of parallel and alternating modes to adapt to complex production needs.

Vision and inspection system
Component identification and inspection
Side-view camera: Real-time monitoring of the component posture at the tip of the nozzle, detection of missing parts, tombstones, skew and other problems, defective product rejection rate ≥99.9%.
Scanning camera: Integrated in the placement head, supports high-speed identification of components within 12mm (such as BGA ball grid array), identification time ≤0.1 seconds/component.
Coplanarity detection (optional): Detect the coplanarity of component pins such as QFP to prevent poor welding and improve the yield of high-end packaging (such as SiP).
Quality assurance function
Automatic nozzle cleaning station: Regularly remove nozzle contaminants to maintain stable adsorption force; nozzle ID tracking management, automatic marking of worn nozzles.
Negative pressure detection: Real-time verification of component adsorption status after picking up to avoid missing or over-sticking.

 Motion Control System
High-precision drive: AC servo motor + linear guide is used for X/Y axis, with mounting accuracy of ±15μm (Cpk≥1.0), and repeat positioning error ≤±10μm, which can meet the mounting of fine pitch components below 0.3mm.
Low-impact mounting: The substrate warping is measured by laser, the mounting height is adjusted dynamically, and the impact force is controlled below 50gf with lightweight suction nozzle to protect ultra-small components and flexible circuit boards<RichMediaReference>superscript:5</RichMediaReference>.
Path optimization: Automatically plan the shortest path based on component distribution, reduce the empty movement distance, and increase the production efficiency of a single substrate by about 20%.

Other core systems
Intelligent software and operation
Automatic data creation: Supports CAD data import, automatically generates mounting programs, and shortens the time for new product introduction by 50%; multi-language interface (Chinese/English/Japanese/Korean), easy to operate.
Remote monitoring and tracing: compatible with Yamaha smart factory system, real-time upload of production data (mounting coordinates, equipment status), supporting full-process quality tracing in industries such as automotive electronics.
Hardware design and maintenance
Compact dual-track structure: The body size is 1,374×2,102×1,445mm and weighs about 2,550kg, saving workshop space and suitable for high-density production line layout.
Tool-free maintenance: The nozzle bracket can be replaced with one button, and the automatic nozzle cleaner supports batch maintenance, reducing daily maintenance time by 40%; the feeder self-diagnosis function warns of faults in real time.
Automation function
Automatic ejector exchange: Automatically adjust the ejector position according to the mounting program, adapt to different substrate thicknesses and component layouts, and reduce manual intervention.
Uninterrupted production: The eATS30 tray feeder supports continuous feeding of 30 layers of trays, and cooperates with the automatic feeder to achieve seamless switching of reel components.