Description

Mounting head system
High-speed multifunctional inline mounting head (HM Head) Placing capacity: equipped with 10 nozzles, supporting from ultra-small components 0201 (0.25×0.125mm) to medium-sized components 100×55mm×15mm (height), covering BGA, CSP, connectors and other special-shaped components, with a maximum mounting speed of 52,000 CPH (optimal conditions), meeting high-density mounting requirements.
High-precision control: Mounting accuracy ±35μm (Cpk≥1.0), reducing thermal deformation by optimizing the X-axis beam structure, ensuring tight mounting of ultra-small components (such as 0201 component spacing ≤0.3mm).
Intelligent identification and efficiency: The head integrates a scanning camera to identify component posture in real time and dynamically optimize the path, reduce invalid movement, and improve productivity; supports automatic nozzle replacement (24 holes standard / 40 holes optional), and the nozzle has ID management for easy maintenance and calibration.
Defect detection function
Side view camera: detects “standing pick” (skew, tombstone) of chip components to avoid defective product placement.
Coplanarity checker (optional): detects lead warping of tray components (such as QFP pin coplanarity) to prevent poor welding.

Feeder system Large capacity and multi-type support
Reel feeding: supports up to 96 components (8mm tape conversion), compatible with 8-56mm tape (F1/F2 feeder), 8-88mm electric tape (F3 feeder), supports continuous feeding and fast material change.
Pallet feeding: optional multi-shelf pallet feeder sATS15R, supports 15 types of pallet components, realizes efficient pallet component supply, and reduces manual intervention.
Lightweight design: uses ultra-thin and lightweight feeder, supports automatic loading (AutoLoading Feeder), shortens material change time by 30%, and improves operation convenience.
Compatibility and flexibility
Supports mixed use of new and old material change trolleys (such as CFB-45E/CFB-36E) to adapt to different production scenarios; tray and reel feeding can run simultaneously to meet the mixed production of multiple varieties.

PCB processing system Substrate size and transmission
Size range: Standard support 50×50mm ~ 510×460mm, optional expansion to 950mm length, suitable for small consumer electronic substrates to medium-sized industrial circuit boards.
Transmission and positioning: The maximum transmission speed is 900mm/sec, equipped with a laser sensor to automatically adjust the transmission width, no mechanical block is required, and compatible with cutouts or special-shaped substrates; the substrate is fixed with a front reference + clamping unit to ensure stability and no offset during mounting.
Diversified production mode
Supports single-track production, adapts to high-density mounting and long-size substrates, and meets the needs of complex circuit boards such as vehicle-mounted and communication equipment.

Vision and inspection system Component identification and inspection
Scanning camera: integrated into the placement head, supports high-speed identification of components within 12×12mm (such as BGA ball grid array), identification time ≤0.1 second/component, reduces the head movement distance, and improves efficiency.
Negative pressure + image dual detection: real-time detection of whether the component is adsorbed successfully after picking up, avoiding missing or over-adhesion, and the defect detection rate is ≥99.9%.
Quality assurance function
Automatic nozzle cleaning: standard cleaning station, regular removal of nozzle contaminants, maintain stable adsorption force; nozzle ID tracking, record usage status, prevent placement deviation caused by nozzle wear.

Motion control system
Drive technology: X/Y axis uses AC servo motor, with high-precision linear guide rail, to achieve high-speed and stable movement, placement head positioning accuracy ±35μm, repeated positioning error ≤±15μm, meet the fine pitch component placement below 0.4mm.
Dynamic path optimization: Automatically plan the shortest path according to component distribution, reduce idle time, and improve single substrate production efficiency by about 15%.

Other core systems
Intelligent software and operation
Automatic data creation: Support CAD data import, automatically generate placement programs, and shorten the time for new product introduction by 50%; equipped with a multi-language interface (Chinese/English/Japanese/Korean), easy to operate.
Remote monitoring and traceability: Compatible with Yamaha’s smart factory system, real-time upload of production data (such as placement coordinates, nozzle status), support full-process quality traceability, and meet the traceability requirements of industries such as automotive electronics.
Hardware design and maintenance
Compact structure: The body size is 1,254×1,440×1,445mm and weighs about 1,230kg, saving workshop space and suitable for compact production line layout.
Tool-free maintenance: The nozzle bracket can be replaced with one button, and the automatic nozzle cleaner supports batch maintenance, reducing daily maintenance time by 40%.