

SP-1200LED | LED Solder Paste Machine
The SP-1200LED LED Solder Paste Machine integrates precision engineering with versatile functionality to meet the demanding needs of LED and SMT assembly. Its imported SMC cylinder-based stencil positioning and advanced image-forming system enable high-accuracy MARK point recognition and stable operation, while the flexible conveyor system with programmable speed and side clamping ensures reliable PCB handling. The multi-mode cleaning structure enhances process efficiency by minimizing residue and consumable waste. With a maximum PCB size of 1200x350mm and printing accuracy of ±0.03mm, this machine is ideal for high-volume LED production, offering a balance of precision, efficiency, and adaptability for modern electronics manufacturing lines.

SP-1200LED | LED Solder Paste Machine
- Description
Description
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Precision Stencil Positioning System
Equipped with an imported SMC cylinder to ensure stable performance and wide applicability, enabling reliable stencil alignment for consistent solder paste deposition across different PCB types. -
Advanced Image-Forming System
Incorporates an internal polarizer to accurately and automatically capture MARK points of various shapes, paired with Japan Kuroda screws on X/Y axes driven by Panasonic motors for precise movement control. This system ensures high recognition accuracy for diverse PCB materials and component layouts. -
Flexible Conveyor System
Supports arbitrary selection of PCB loading direction (left to right or right to left) with programmable transportation speed, ensuring precise PCB stop positions. The side clamping structure guarantees a flat and secure contact between the board and stencil, minimizing printing errors. -
Efficient Cleaning Structure
Utilizes a combination of dry, wet, and vacuum cleaning methods, allowing controlled usage of cleaning paper and solution. This design ensures thorough stencil cleaning, reduces consumable waste, and maintains consistent printing quality.
specification
SP-1200LED | SP-1500 | ||
Screen Frame | Min. size | 737x300mm | 1100x300mm |
Max. size | 1500x750mm | 1800x750mm | |
Thickness | 25~40mm | ||
PCB Board | Min. size | 80x50mm | |
Max. size | 1200x350mm | 1500x350mm | |
Thickness | 0.4~6mm | ||
Warpage | <1% | ||
Transport | Height | 900±40mm | |
Direction | L→R,R→L;L→L,R→R | ||
Speed | Max.1500mm/S (Programmable) | ||
PCB Positioning | Support System | Magnetic Pin/Support block by hand/Up-down table adjustment | |
Clamping System | Elastic Side Clamp/Z Directional Press | ||
Cleaning System | Dry, wet, vacuum (Programmable) | ||
Table Adjustment Ranges | X:±10mm;Y±10mm;θ:±2° | ||
2D Solder Paste Inspection | Standard configuration | ||
Power Input | AC:220±10%,50/60HZ 1q3KW | ||
Control Method | PC control | ||
Dimension | L2210*1213*H1500m m | L2500*1200*H1500m m | |
Weight | Approx.1500Kg | Approx.1800Kg | |
Printing Parameter | |||
Squeegee Type | Stainless steel (Standard),Plastic | ||
Substrate Separation Speed | 0.1-20mm/sec(Programming) | ||
Squeegee Speed | 6-200mm/sec | ||
Squeegee Pressure | 0-15Kg(Air pressure control) | ||
Squeegee Angle | 60%/55°/45° | ||
Repeat Position Accuracy | ±0.015mm | ||
Printing Accuracy | ±0.03mm | ||
Cycle time | <15s(Exclude Printing & Cleaning) | <12s (Exclude Printing & Cleaning) | |
Product Changeover | <5Min | ||
Air Required | 4.5-6Kg/cm2 |
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