SP-1200LED | LED Solder Paste Machine

The SP-1200LED LED Solder Paste Machine integrates precision engineering with versatile functionality to meet the demanding needs of LED and SMT assembly. Its imported SMC cylinder-based stencil positioning and advanced image-forming system enable high-accuracy MARK point recognition and stable operation, while the flexible conveyor system with programmable speed and side clamping ensures reliable PCB handling. The multi-mode cleaning structure enhances process efficiency by minimizing residue and consumable waste. With a maximum PCB size of 1200x350mm and printing accuracy of ±0.03mm, this machine is ideal for high-volume LED production, offering a balance of precision, efficiency, and adaptability for modern electronics manufacturing lines.

SP-1200LED | LED Solder Paste Machine

In stock

Description

  1. Precision Stencil Positioning System
    Equipped with an imported SMC cylinder to ensure stable performance and wide applicability, enabling reliable stencil alignment for consistent solder paste deposition across different PCB types.
  2. Advanced Image-Forming System
    Incorporates an internal polarizer to accurately and automatically capture MARK points of various shapes, paired with Japan Kuroda screws on X/Y axes driven by Panasonic motors for precise movement control. This system ensures high recognition accuracy for diverse PCB materials and component layouts.
  3. Flexible Conveyor System
    Supports arbitrary selection of PCB loading direction (left to right or right to left) with programmable transportation speed, ensuring precise PCB stop positions. The side clamping structure guarantees a flat and secure contact between the board and stencil, minimizing printing errors.
  4. Efficient Cleaning Structure
    Utilizes a combination of dry, wet, and vacuum cleaning methods, allowing controlled usage of cleaning paper and solution. This design ensures thorough stencil cleaning, reduces consumable waste, and maintains consistent printing quality.

specification


SP-1200LED

SP-1500

Screen Frame

Min. size

737x300mm

1100x300mm

Max. size

1500x750mm

1800x750mm

Thickness

25~40mm

PCB Board

Min. size

80x50mm

Max. size

1200x350mm

1500x350mm

Thickness

0.4~6mm

Warpage

<1%

Transport

Height

900±40mm

Direction

L→R,R→L;L→L,R→R

Speed

Max.1500mm/S (Programmable)

PCB Positioning

Support System

Magnetic Pin/Support block by hand/Up-down table adjustment

Clamping System

Elastic Side Clamp/Z Directional Press

Cleaning System

Dry, wet, vacuum (Programmable)

Table Adjustment Ranges

X:±10mm;Y±10mm;θ:±2°

2D Solder Paste Inspection

Standard configuration

Power Input

AC:220±10%,50/60HZ 1q3KW

Control Method

PC control

Dimension

L2210*1213*H1500m m

L2500*1200*H1500m m

Weight

Approx.1500Kg

Approx.1800Kg

Printing Parameter

Squeegee Type

Stainless steel (Standard),Plastic

Substrate Separation Speed

0.1-20mm/sec(Programming)

Squeegee Speed

6-200mm/sec

Squeegee Pressure

0-15Kg(Air pressure control)

Squeegee Angle

60%/55°/45°

Repeat Position Accuracy

±0.015mm

Printing Accuracy

±0.03mm

Cycle time

<15s(Exclude Printing & Cleaning)

<12s (Exclude Printing & Cleaning)

Product Changeover

<5Min

Air Required

4.5-6Kg/cm2

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