Description

1. Pure Tin Composition with Minimal Waste
   Crafted from high-purity tin, reducing tin slag formation during soldering to minimize material waste. This feature ensures cost efficiency and maintains a clean working environment.
2. Superior Oxidation Resistance
   Formulated with sufficient antioxidant materials to prevent surface oxidation, preserving solder fluidity and joint quality even in high-temperature soldering processes.
3. Versatile Soldering Process Compatibility
   Suitable for both automated and manual soldering, adapting to diverse production lines. Its flux-injected design ensures consistent performance across wave soldering, selective soldering, and high-temperature applications.
4. Optimal Flux Distribution
   Engineered with evenly distributed flux in the tin core, eliminating flux breakage and reducing smoke/spatter during welding. This results in cleaner operations and lower post-soldering maintenance.
5. Bright and Robust Solder Joints
   Delivers full, bright solder joints with high strength and electrical conductivity, meeting rigorous reliability standards for electronic components.