

SOLDER BAR
Nectec’s Solder Bars combine diverse alloy technology with rigorous quality control to offer reliable soldering solutions for electronic assembly. With alloys ranging from lead-free Sn-Ag-Cu systems to traditional Sn-Pb compositions, these bars cater to environmental standards (RoHS compliant) and legacy manufacturing needs. Key features—including excellent oxidation resistance, high joint integrity, and compatibility with wave/selective soldering—make them ideal for industries such as automotive, consumer electronics, and telecommunications. Backed by ISO 9001 and IATF 16949 certifications, Asahi ensures consistent performance, while global production hubs in Zhuhai, Vietnam, and Malaysia guarantee scalable supply and technical support for high-volume manufacturing.

SOLDER BAR
- Description
Description
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Diverse Alloy Compositions for Versatile Applications
Formulated with a range of alloys, including lead-free options (e.g., Sn96.5Ag3.0Cu0.5, melting point 217–220°C) and lead-based alloys (e.g., Sn63Pb37, melting point 183°C). This variety caters to different industry needs, from high-temperature automotive electronics to low-temperature consumer devices. -
Excellent Oxidation Resistance
Integrated with sufficient antioxidant materials to prevent tin oxidation during soldering, ensuring stable performance and reducing surface defects. This feature maintains solder joint integrity even in high-temperature processes. -
Superior Solder Joint Quality
Delivers bright, full, and defect-free solder joints with high strength and conductivity. The pure tin base material minimizes waste and ensures consistent metallurgical bonding across various substrates. -
Wide Process Adaptability
Specifically designed for wave soldering, selective soldering, and high-temperature soldering processes. Its low surface tension and optimal fluidity enable efficient wetting on complex PCB layouts. -
Uniform Flux Distribution
Engineered with evenly distributed flux to ensure minimal smoke, spatter, and residue during soldering. This reduces post-soldering cleaning needs and enhances production efficiency.
specification
Series | Alloy composition | Melting pointC |
990 | Sn99.9 | 232 |
980 | Sn96.5Ag3.0Cu0.5 | 217-220 |
960 | Sn98.5Ag1.0Cu0.5 | 217-225 |
915 | Sn98.5Ag0.8Cu0.7 | 227 |
910 | Sn99Ag0.3Cu0.7 | 217-228 |
930 | Sn97Ag3.0 | 221 |
903 | Sn99.7Ag0.3 | 232 |
900 | Sn99.3Cu0.7 | 227 |
950 | Sn-Cu-Ni-Ge | 227 |
993 | Sn99.3Cu0.7Ni/Ge/Ag | 227 |
690 | Sn42Bi58 | 138 |
470 | Sn63Pb37 | 183 |
