SOLDER BAR

Nectec’s Solder Bars combine diverse alloy technology with rigorous quality control to offer reliable soldering solutions for electronic assembly. With alloys ranging from lead-free Sn-Ag-Cu systems to traditional Sn-Pb compositions, these bars cater to environmental standards (RoHS compliant) and legacy manufacturing needs. Key features—including excellent oxidation resistance, high joint integrity, and compatibility with wave/selective soldering—make them ideal for industries such as automotive, consumer electronics, and telecommunications. Backed by ISO 9001 and IATF 16949 certifications, Asahi ensures consistent performance, while global production hubs in Zhuhai, Vietnam, and Malaysia guarantee scalable supply and technical support for high-volume manufacturing.

Category:

SOLDER BAR

In stock

Description

  1. Diverse Alloy Compositions for Versatile Applications
    Formulated with a range of alloys, including lead-free options (e.g., Sn96.5Ag3.0Cu0.5, melting point 217–220°C) and lead-based alloys (e.g., Sn63Pb37, melting point 183°C). This variety caters to different industry needs, from high-temperature automotive electronics to low-temperature consumer devices.
  2. Excellent Oxidation Resistance
    Integrated with sufficient antioxidant materials to prevent tin oxidation during soldering, ensuring stable performance and reducing surface defects. This feature maintains solder joint integrity even in high-temperature processes.
  3. Superior Solder Joint Quality
    Delivers bright, full, and defect-free solder joints with high strength and conductivity. The pure tin base material minimizes waste and ensures consistent metallurgical bonding across various substrates.
  4. Wide Process Adaptability
    Specifically designed for wave soldering, selective soldering, and high-temperature soldering processes. Its low surface tension and optimal fluidity enable efficient wetting on complex PCB layouts.
  5. Uniform Flux Distribution
    Engineered with evenly distributed flux to ensure minimal smoke, spatter, and residue during soldering. This reduces post-soldering cleaning needs and enhances production efficiency.

specification

Series

Alloy composition

Melting pointC

990

Sn99.9

232

980

Sn96.5Ag3.0Cu0.5

217-220

960

Sn98.5Ag1.0Cu0.5

217-225

915

Sn98.5Ag0.8Cu0.7

227

910

Sn99Ag0.3Cu0.7

217-228

930

Sn97Ag3.0

221

903

Sn99.7Ag0.3

232

900

Sn99.3Cu0.7

227

950

Sn-Cu-Ni-Ge

227

993

Sn99.3Cu0.7Ni/Ge/Ag

227

690

Sn42Bi58

138

470

Sn63Pb37

183

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