Description

High-Speed Placement Performance

1. Throughput Capability:
   • Theoretical maximum placement speed: 30,000 CPH (single cantilever architecture, 6-axis coordinated motion). Actual speed varies by component complexity and program optimization.
2. Positional Accuracy:
   • Standard Chip components: ±40μm (±3σ)
   • QFP packages: ±30μm (±3σ)
3. Component Handling Range:
   • Supports 0603 metric (0.6×0.3mm) to 55×55mm components (max height 15mm), including micro resistors/capacitors, ICs, and odd-form connectors (e.g., 75mm-long variants).

Vision & Inspection System

1. In-Flight Vision Technology:
   • Real-time component recognition during head traversal reduces idle time and enhances throughput.
2. Polygon Recognition Module:
   • Enhances odd-form component placement (e.g., BGA, QFN) with high-precision alignment for 55mm ICs.
3. Fixed-Mount Camera (FOV45):
   • Dedicated to PCB fiducial mark detection, ensuring substrate transport accuracy and mounting coordinate precision.

Feeder System Architecture

1. Powered Feeder Platform (eFeeder):
   • Supports 120×8mm tape feeders, backward-compatible with SM series pneumatic feeders for seamless legacy system integration.
2. Intelligent Pick Positioning:
   • Optimizes component pickup coordinates to reduce mispick rates and material waste.
3. Smart Feeder Technology:
   • Enables automatic tape splicing and real-time shortage alerts to maintain production continuity.

PCB Processing Capabilities

1. Substrate Dimensions:
   • Single-track mode: 50×40mm–460×400mm
   • Dual-track mode: up to 460×250mm per track
2. Expansion Options:
   • Optional upgrade supports 740×460mm substrates for LED/long-display PCB production.
3. Material Compatibility:
   • Handles 0.38–4.2mm-thick PCBs, including flexible and rigid substrates.

Motion Control & Vacuum System

1. Dual Servo Y-Axis Drive:
   • Enhances conveyor stability during high-speed operation, minimizing vibration-induced placement errors.
2. Optimized Vacuum Dynamics:
   • Vacuum pump system ensures pickup consistency while reducing air consumption to 180NL/min for energy efficiency.

Intelligent Software & Maintenance

1. Adaptive Calibration Suite:
   • Dynamically corrects pickup position, head alignment, and track coordinates to compensate for environmental variations.
2. Modular Tooling Design:
   • Automatic nozzle changer supports 20+ configurations (standard/optional), streamlining maintenance and changeovers.