Description

1. Placement head and identification system
Multi-nozzle high-speed placement head: SpeedStar CP20: supports 0201 metric (0.2×0.1mm) to 8.2×8.2×4mm components, with a theoretical speed of 93,000 CPH (maximum accuracy 20μm).
Dual cantilever configuration: Some models (such as TX micron) are equipped with dual placement heads, and the placement speed is increased to 96,000 CPH (dual-head collaborative operation), supporting 26 components per second.
Dynamic pressure control: Automatically adjust the placement pressure (1.0N~15N) according to the component type, adapting to the non-destructive placement of sensitive components (such as thin chips, flip chips).
Laser and visual recognition: LNC laser sensor: Real-time detection of component position, angle and height, with an accuracy of ±0.05mm (Cpk≥1), supporting on-the-fly recognition to reduce downtime.
High-resolution image processing: Blue light technology is used to enhance image contrast, support BGA solder balls, chip cracks and other fine structure detection, meet ISO 7 clean room standards.

2. Feeder system
Mixed feeding compatibility: Supports 8mm to 56mm electric feeders, tube-mounted, tray-mounted components and JEDEC standard trays, with a maximum feeder capacity of 120 stations (calculated based on 8mm belt type).
SIPLACE Tray device: Can accommodate 82 JEDEC trays or 41 wide trays (355×275mm), support non-stop feeding, and improve continuous production efficiency.
Smart Feeder technology: Automatic material connection and material shortage warning, combined with buffer and main storage area design, reduce manual intervention.

3. PCB processing capabilities
Substrate size expansion: Standard support for 300×240mm substrates (accuracy 15μm@3σ), long board options extended to 590×460mm, compatible with flexible boards, curved boards and PCBs with a carrier height of up to 20.5mm.
The multifunctional conveying system supports J-boat carriers and JEDEC trays, and is suitable for high reliability requirements such as automotive electronics.
Motor-driven support table: reduces substrate transmission vibration, improves mounting stability, and shortens fixing time.

4. Software and intelligent functions
Open automation interface: supports IPC-CFX, IPC-HERMES-9852 protocols, seamlessly integrates MES/ERP systems, and realizes full-process data traceability (such as automotive electronics).
JaNets production management system: supports offline programming, path optimization and simulation debugging, and shortens line change time.
Predictive maintenance and diagnosis: Sensors monitor equipment status in real time, provide maintenance warnings, and reduce downtime risks.

5. Technical advantages and application scenarios
SiP production optimization: single machine integrates SMT high-speed mounting (93,000 CPH) and chip bonding process (62,000 CPH@10μm accuracy), suitable for the production of SiP modules such as smartphones and smart watches. Supports precise and dense arrangement of passive SMD components, with a minimum pitch of 50μm, to meet high-density packaging requirements.
High reliability of automotive electronics: Provides material-level traceability to ensure production data transparency, passes SEMI S2/S8 certification, and adapts to harsh environmental requirements.
Function expansion of end-of-line machine: Equipped with TwinHead placement head to handle special-shaped components (maximum 200×110×25mm, weight 160g), replaces robots or manual operations, and saves 27.5% of floor space.