SIPLACE X S product image 1 2
SIPLACE X S | High-speed placement - Image 1
SIPLACE TX product image 1 1 SIPLSCE TX | High Speed Component Placement Machine
SIPLACE SX product image 1 1 SIPLACE-SX | Cantilever modular placement machine

SIPLACE X S | High-speed placement

The SIPLACE X S is benchmark in high-volume production
Absolute precision and maximum performance have made the SIPLACE X S the placement platform of choice for demanding high-volume production applications such as network infrastructure (5G), large boards for server and industrial segments. Wherever top speed, lowest dpm rates, non-stop setup changeovers, fast new product introductions and the high-speed placement of the latest generations of super-small components (0201 metric) are needed.

Category:

SIPLACE X S | High-speed placement

In stock

Description

1. Placement Head System Architecture

SpeedStar CP20 High-Speed Placement Head

Engineered for ultra-high-speed placement, the SpeedStar CP20 supports 0201 metric (0.2×0.1mm) micro-components with a theoretical placement throughput of 76,450 CPH. Equipped with dynamic pressure modulation, it enables non-destructive placement of sensitive devices with ±30μm @4σ accuracy, meeting rigorous requirements for high-density PCBs in 5G network equipment and server motherboards.

MultiStar Versatile Placement Head

Featuring three operational modes (collect-place, pick-place, and mixed-mode), the MultiStar head flexibly handles 01005 to 200×110mm odd-form components (e.g., heat sinks, connectors), addressing expansion needs beyond standard component profiles.

TwinHead Heavy-Duty Placement Module

Optimized for large odd-shaped components, the TwinHead supports placement of devices up to 25mm in height and 160g in weight (e.g., LED lenses, power modules), ideal for high-reliability applications in automotive electronics.

2. Modular Cantilever & Conveyor System

Cantilever Modularity Design

Configurable as single, dual, or triple cantilever architectures (e.g., SIPLACE X3 S), the modular design allows users to adjust cantilever quantity within 30 minutes for dynamic capacity scaling, without altering production line layouts.

Intelligent Conveyor System

The single-lane model processes 450×560mm PCBs as standard, expandable to 850×560mm with long-board software licensing—suitable for ultra-long substrates like LED panels. Smart Pin Support technology automatically adjusts PCB support pin positions to mitigate flexure and vibration during transport, enhancing placement stability for thin-long boards.

3. Vision Inspection & Metrology System

Digital Imaging Subsystem

The high-resolution vision system integrates multi-angle illumination technology for barcode verification and component polarity inspection, ensuring process traceability and consistency. Blue-light imaging enhances contrast for detecting micro-defects such as BGA solder ball anomalies and chip fractures, compliant with ISO Class 7 cleanroom standards.

LNC Series Laser Sensing

Real-time in-flight laser profiling measures component position, orientation, and height with ±50μm accuracy, enabling on-the-fly verification and minimizing machine downtime.

4. Feeder System & Material Management

Smart X Feeder Platform

Compatible with 8mm to 56mm powered feeders, the Smart X system supports tube/tray component feeding with a maximum 160-station capacity, optimized for high-mix production environments.

Intelligent Feeding Technology

Incorporating automatic material splicing and shortage alert functions, Smart Feeder technology—combined with buffer zone design—enables continuous production without interruptions.

5. Software Ecosystem & Intelligent Functions

Offline Programming & Trajectory Optimization

Using SIPLACE Pro software, CAD data import and simulation debugging optimize component placement sequences, reducing changeover time to minutes via intelligent path planning.

Data Traceability Infrastructure

Supporting IPC-CFX and SECS/GEM protocols, the system enables seamless MES/ERP integration for full-process data transparency, meeting traceability demands in automotive electronics manufacturing.

Predictive Maintenance Framework

Real-time sensor networks monitor equipment health metrics, providing proactive maintenance alerts to minimize unplanned downtime risks.

Technical Terminology Enhancements:

  • Precision Metrics: Standardized accuracy units to μm, clarified sigma levels (4σ)
  • System Architecture: Used “subsystem”, “module”, “platform” to denote hierarchical components
  • Process Terms: Employed “in-flight verification”, “trajectory optimization”, “powered feeders” per SMT industry conventions
  • Compliance References: Specified ISO cleanroom class and industrial protocols explicitly
  • Component Handling: Differentiated “odd-form”, “micro-components”, “heavy-duty” for clear application contexts

specification

Technical data*

SIPLACE X2 S

SIPLACE X3 S

SIPLACE X4 S

SIPLACE X4i S

Speed (benchmark rating**)

75,000 cph

112,500cph

150,000 cph

172,000 cph

Speed (IPC rating)

65,000 cph

97,050cph

130,000cph

146,000 cph

Feeder slots

160 x 8 mm

148 x 8 mm

Component spectrum

0201 metric to 200 mm x110 mm x 25 mm

Board sizes

50 mm x 50 mm to 850 mm x685 mm

Machine dimensions (LxWxH)

1.9 mx2.6mx1.6m

Placement heads

Placement Head CP20, Placement Head CPP, Placement Head TWIN

Placement accuracy

22 μm @3 σ (with Placement Head TWIN)

Conveyors

Single conveyor, flexible dual conveyor

Related Products

ADD TO INQUIRY

SIPLACE CA2 | Hybrid Mounter

ADD TO INQUIRY

SIPLACE-SX | Cantilever modular placement machine

ADD TO INQUIRY

SIPLSCE TX | High Speed Component Placement Machine

Register NOW “Join us at global exhibitions and connect with industry leaders”

GET STARTED NOW