SIPLACE SX product image 1 1
SIPLACE-SX | Cantilever modular placement machine - Image 1
SIPLACE X S product image 1 2 SIPLACE X S | High-speed placement

SIPLACE-SX | Cantilever modular placement machine

SIPLACE SX is the first placement solution that is fully scalable with demand thanks to its unique interchangeable gantries. A great way to add capacity when needed or reduce capacity when things slow down. We call it ASMPT Capacity-on-Demand.The SIPLACE SX-Series puts scalability and flexibility at the top of the list. Users are able to introduce new products quickly, change setups without stopping the line and produce any batch size with high utilization and efficiency.Whether in automotive, automation, medical, telecommunication or IT infrastructure – the ASMPT SX-Series meets all requirements in terms of quality, process reliability and speed.

Category:

SIPLACE-SX | Cantilever modular placement machine

In stock

Description

1. Modular Cantilever Architecture & Placement Head System

Cantilever Modularity Design

The SIPLACE SX stands as the world’s only placement platform supporting dynamic capacity configuration via cantilever addition/removal. Users can adjust cantilever quantity within 30 minutes to flexibly respond to capacity demands, safeguarding existing investments. Configurable as single-cantilever (SX1) or dual-cantilever (SX2) architectures, it ensures high scalability without altering production line layouts.

Diverse Placement Head Configurations

  • SpeedStar CP20 Head: Supports 0201 metric (0.2×0.1mm) to 8.2×8.2×4mm components, achieving 43,250 CPH placement speed with ±35μm @3σ accuracy, ideal for high-speed/high-precision applications.
  • MultiStar & TwinStar Heads: Handles large complex components (up to 50×150mm, 240g), provides up to 100N placement force, and supports THT processes (e.g., pin bending).
  • CPP Placement Head: Enables pick-collect-mix mode switching, compatible with components ≤15.5mm height and ≤20g weight.

2. Vision Inspection System & Imaging Algorithms

High-Resolution Visual Processing

The new camera system integrates multi-angle lighting and multi-exposure imaging, generating 3D visual models to optimize process control. It detects complex features like pin status and component coplanarity. LED center positioning technology aligns components via top-surface references, enhancing placement accuracy for 异型元件 (e.g., BGA, QFP).

Laser Recognition Technology

Real-time laser profiling tracks component height and position, minimizing errors from contaminated/worn nozzles. It supports non-contact placement to protect sensitive components.

3. Feeder System Compatibility Design

Feeding Capacity & Compatibility

Standard 120-station 8mm tape feeder configuration suits both small-batch multi-variety and mass production. Open third-party feeder interfaces enable rapid integration of specialized feeders (e.g., GlueFeeder X, Measuring Feeder X). The system supports tube/tray components and JEDEC-standard trays, combined with Smart Feeder technology for automatic material splicing and shortage alert.

4. PCB Processing Capabilities

Substrate Size & Conveyor System

Standard support for 50×50mm~610×590mm PCBs; expanded configuration handles up to 1,525mm-long substrates (e.g., LED panels), compatible with flexible/rigid boards. The smart conveyor module features automatic pin support (Smart Pin Support) to reduce transmission vibration and enhance placement stability.

5. Intelligent Software & Automation Interfaces

Smart Operation Functions

  • Nozzle ID Management: Automatically identifies nozzle status, supports intelligent selection/replacement across 320 nozzle positions to prevent misoperations.
  • Predictive Maintenance System: Real-time sensor monitoring provides maintenance warnings, reducing downtime risks.
  • Intelligent Operator Guidance: Process wizards assist in solving placement issues (e.g., height calibration, fiducial setting), shortening setup time.

Open Automation Interfaces

Supports IPC-CFX, IPC-9852-Hermes protocols for seamless MES/ERP integration, enabling full-process data traceability in automotive electronics.

6. Scalable Application Solutions

Odd-Shaped Component (OSC) Processing Kit

Enables placement of 200×110×25mm, 160g components (e.g., heat sinks, connectors), integrating automatic feeding and inspection workflows.

Automotive Electronics Optimization Package

Collaborating with DEK TQ L printing platform, it meets high-precision/reliability SMT requirements, supporting end-to-end data traceability.

specification

Technical data*  

SIPLACE SX1

SIPLACE SX2

Placement speed**

43,000 cph

86,500 cph

Placement speed(IPC)

33,000 cph

66,000 cph

Feeder capacity

120 x 8mm slots

Component spectrum

0201(metric) to 200 mm x 110 mm x 50 mm

Board size

50 mm x 50 mm to 1,525 mm x 560 mm

Machine dimensions (L x W x H)

1.5mm x 2.8m x 1.8m

Placement heads

Placement Head CP20P, Placement Head CPP, Placement Head 

Placement accuracy

22 μm @ 3 σ (with Placement Head TH)

Conveyors

Single-track conveyor, flexible dual-track conveyor

Related Products

ADD TO INQUIRY

SIPLACE CA2 | Hybrid Mounter

ADD TO INQUIRY

SIPLACE X S | High-speed placement

ADD TO INQUIRY

SIPLSCE TX | High Speed Component Placement Machine

Register NOW “Join us at global exhibitions and connect with industry leaders”

GET STARTED NOW