Description

Mounting head system
12-axis mounting head + 2θ rotation axis: adopts multi-nozzle design, supports mixed mounting of 0201 (0.2×0.1mm) to 120×90mm special-shaped components (such as BGA, CSP, connector), and the theoretical mounting speed reaches 45,000 CPH (under optimal conditions).
Dynamic pressure control: adjust the Z-axis height and pressure through AC servo motor to adapt to different component thicknesses (up to 30mm) to prevent damage to precision components.
θ axis control: supports ±180° rotation mounting to ensure accurate positioning of component polarity.

Vision and inspection system
Dual precision recognition mode: mounting accuracy A (chip components): ±0.040mm @ μ+3σ. Mounting accuracy B (IC components): ±0.025mm @ μ+3σ.
Image inspection and negative pressure detection: check component polarity and pin status through image recognition technology, and determine whether the component is brought back in combination with negative pressure sensor to reduce the throw rate.
Standard multi-vision camera and laser unit support rapid identification of sheet components and special-shaped devices.

Feeder system
Mixed feeder compatibility: supports 8-88mm electric feeders (F3 series), 8-56mm tape feeders (F1/F2 series), rod feeders and tray-mounted components, with a maximum feeder capacity of 180 types (calculated based on 8mm tape).
Smart Feeder technology: automatic material connection and material shortage warning, reducing manual intervention and improving continuous production efficiency.

 PCB processing capacity
Ultra-large substrate compatibility: supports substrates from a minimum of 50×30mm to a maximum of 1,830×510mm (standard size 1,455×510mm) in standard mode, and supports long substrate production (such as LED light boards) after expansion.
Buffer function optimization: When using entry/exit buffers, it can handle substrates up to 540×510mm to meet high-frequency line change requirements.
Transmission speed and stability: The substrate transmission speed reaches 900mm/sec, equipped with a clamping fixing unit and automatic track width adjustment function to ensure high-precision positioning.

Motion control system
High-precision linear drive: The X/Y axis uses linear motors and magnetic suspension technology, combined with a 0.001mm resolution magnetic scale to achieve micron-level positioning under high-speed movement.
Dual servo Y-axis drive: optimizes track transmission stability and reduces vibration during high-speed placement.

Software and intelligent functions
Multilingual operation interface: supports Japanese, Chinese, Korean, and English, which facilitates global production management.
VIOS software system: real-time display of placement status, error alarms and correction information, integrated path optimization algorithm, shortening line change time.
Offline programming support: optimize component placement sequence and improve production efficiency through CAD data import and simulation debugging.