Description

Mounting head system
High-speed and high-precision mounting: Equipped with 12-axis 20-mounting head units, the mounting speed can reach 0.08 seconds/CHIP (45,000CPH) under optimal conditions, the CHIP mounting accuracy is ±0.040mm (μ+3σ), the IC mounting accuracy is ±0.025mm (μ+3σ), and the mounting angle range is ±180 degrees. It can meet the mounting needs from 0201mm tiny chips to 120×90mm large components, including BGA, CSP, connectors and other special-shaped components.
Z-axis and θ-axis control: Both the Z-axis and the θ-axis are controlled by AC servo motors to achieve precise height adjustment and angle control, ensuring the position accuracy of components during the mounting process. It can handle components with a maximum height of 30mm (the maximum height of the first mounted component is 25mm), and has a real-time force control function, which can reduce the force on the components and is suitable for mounting pressure-sensitive components and plug-in components.
Nozzle exchange function: Supports automatic identification of nozzle IDs. Automatic nozzle replacement uses a 24-hole (standard) and 40-hole (optional) nozzle exchange station. The nozzles can be freely discharged on the nozzle exchange station, which is convenient for quickly replacing the appropriate nozzle according to the component type and improving production efficiency. In addition, by adopting a newly developed dispensing head that can be interchanged with the mounting head, 3D mounting that interacts with solder paste dispensing and component mounting becomes possible, realizing mixed mounting.

 Feeder system
Multiple feeding methods compatible: Supports 8-56mm tape (F1/F2 feeder), 8-88mm tape (F3 electric feeder), rod feeder and tray and other feeding methods, which can meet the feeding needs of components in different packaging forms and enhance production flexibility.
Large-capacity feeding capacity: The maximum number of feeders is 90 (45 × 2) converted to 8mm tape, which can accommodate multiple different types of components at the same time, reduce frequent material changes, and improve production continuity.
Feeder compatibility: The new material change trolley with 45 feeder tracks can be mixed with existing material change trolleys, such as F3 electric feeder one-time material change trolley “CFB-45E”, “CFB-36E”, F1/F2 pneumatic feeder one-time material change trolley “CFB-36”, etc. Users can freely choose the combination according to production needs and budget.

PCB handling system
Large-size and diversified substrate handling: Supports PCBs of various sizes, with a minimum size of L50 x W30mm and a maximum size of L1,330 x W510mm (standard L955) when the buffer function is not used; with a maximum size of L420 x W510mm when the inlet or outlet buffer function is used; with a maximum size of L330 x W510mm when the inlet and outlet buffer functions are used. It can handle PCBs with a thickness of 0.4 – 4.8mm, and can cope with the production of circuit boards with different shapes and sizes, including long-sized substrates, which enhances the applicability of the equipment.
Efficient conveying system: The substrate conveying direction defaults to left to right, and the conveying speed can reach a maximum of 900mm/sec. Equipped with input and output buffer conveyor belt systems, the best conveying settings can be automatically selected according to the PCB size. Laser sensors are used for substrate positioning. Without the need for mechanical PCB stops, they can automatically provide optimal positioning for PCBs of various sizes and shapes (including PCBs with cutouts), improving transmission accuracy and efficiency.
Flexible positioning and clamping: Through the clamp-in substrate fixing unit, the front side reference, and the automatic adjustment of the transmission width, the PCB can be accurately positioned and stably clamped to ensure that the PCB position is fixed during the mounting process and reduce mounting errors.

Vision and inspection system
Component take-back detection: Negative pressure inspection and image inspection are used to determine whether the component is taken back after mounting, and to detect mounting abnormalities in time to avoid problems such as missing or over-mounting, thereby ensuring mounting quality.
Color reference mark recognition camera: The reference mark recognition camera uses a color camera and is equipped with a newly developed lighting unit, which can easily cope with dispensing inspection. By accurately identifying the reference mark, the accuracy of component mounting and the accuracy of overall production can be improved. In addition, the standard wide-field reference camera can identify workpieces based on the best color elements of the workpiece (reference mark and installed components).
Powerful component recognition capability: The standard camera can recognize components from 0402mm to 120x90mm (optional support for 0201mm and above), and can handle the recognition process of almost all components, without worrying about component specifications. The optional rear multi-scan camera can ensure more efficient component placement, further improving the adaptability and placement efficiency of the equipment for different components.

Motion control system

The AC servo motor controls the movement of each axis, combined with a high-precision mechanical structure to ensure the stability and positioning accuracy of the placement head and PCB during movement, meet the high-speed and high-precision placement requirements, and achieve precise placement operations. Although the document does not elaborate on the specific details of motion control, it can be inferred from the placement accuracy and speed indicators that its motion control system has excellent performance.

Other systems
Multilingual operation interface: Supports operation interfaces in multiple languages ​​such as English, Chinese, Korean, and Japanese, which is convenient for operators in different regions to use, reduce the difficulty of operation, and improve the versatility and ease of use of the equipment.
3D MID mounting expansion capability: It can be expanded to mount 3D MID (three-dimensional molded interconnect device). The equipment can perform solder paste dispensing and component mounting on three-dimensional objects with different heights, angles and directions such as concave and convex surfaces, inclined surfaces, and curved surfaces, providing the possibility of 3D MID production in the fields of automotive, medical, and communication equipment, and expanding the application scope of the equipment.
Flexible configuration and switchability: Users can freely choose different front and rear, left and right feeder configurations according to production needs and budgets, and can also use a full range of modification kits to achieve the conversion between fixed feeder groups and feeder carts/tray feeders. It has strong versatility and switchability, and can adapt to diverse production needs.