Description

 Placement head system (P20 high-precision placement head)
Placement speed: up to 100,000 CPH (under optimal conditions, for small chips such as 0201), supporting high-speed pick-up and placement of single reel tape.
Component adaptability: Designed for ultra-small chips (0201 and above) and small ICs, it can handle component sizes ranging from 0201 to □5mm and heights ≤3mm (such as high-density, high-precision placement scenarios such as LED edge lights).
Low-impact placement technology: supports independent adjustment of the nozzle’s downward pressure/upward speed to reduce the impact on components and substrates (especially flexible circuit boards) during placement, ensuring stable placement of micro components.
Real-time visual correction: integrated with advanced centering and detection visual systems, automatically corrects component position deviations after picking, improves placement accuracy to ±40μm (Cpk≥1), and effectively avoids defects such as flipping.
In-flight detection: supports component presence detection and polarity recognition to ensure that the component status meets the requirements before placement.

Vision System
Coaxial lighting technology: The new XO coaxial lighting is used to provide clearer component images and improve the recognition accuracy and stability of micro components such as 0201.
Multi-function detection: Real-time detection of defects such as missing components and flipping, and automatic correction of the pick-up position to improve the success rate of component pick-up.
Mark point recognition: Supports high-precision positioning of substrate mark points, compensates for substrate deformation or position deviation, and ensures the consistency of mounting position.
Single track mode: Substrate size 50×50～510×450mm (only 50-350mm length supports BOC, Bad Mark, 2D barcode reading).
Long board mode: Supports simultaneous processing of two substrates with a length of ≤420mm, improving the production efficiency of double boards.

Feeding system
High-density feeding: Two rolls of 8mm tape can be installed in a single traditional feeder space (17mm), and the feeder capacity is up to 56 types (when using RF08AS), supporting 8mm to 88mm tapes, and compatible with diversified feeding from small chips to large components.
Automatic pick-up position correction: Dynamically adjust the feeder position according to the component recognition results to ensure stable picking.
Batch replacement trolley: Supports the mixed use of electric feeders and mechanical feeders, and quickly replaces the feeding group through the trolley to reduce the changeover time.
Status visualization: The LED indicator shows the working status of the feeder in real time, and flashes to locate the problem feeder when a fault occurs.
Supports existing mechanical feeders and batch replacement trolleys to protect users’ existing assets; supports multiple feeding methods such as tape and tray (optional accessories required).

Motion control system
Compact and efficient design: Adopting a lightweight gantry structure, the equipment width is only 998mm, achieving the highest placement efficiency per unit area (industry-leading placement rate per square meter).
High-precision positioning: The XY axis repeat positioning accuracy meets the mounting accuracy of ±40μm (Cpk≥1), and the Z axis supports component height adaptation to ensure vertical mounting.
Flexible substrate processing: Supports single-track large-size substrates (up to 510×450mm) or dual-track small substrates (processing two substrates ≤420×250mm at the same time), adapting to the production needs of multiple varieties.
Substrate stabilization technology: Through vacuum adsorption and mechanical clamping devices, the vibration of the substrate during the mounting process is reduced, and the stability during high-speed mounting is improved.

Software system
Full process management: Supports offline programming of production programs, multi-machine data sharing, real-time monitoring of equipment status (such as Factory Dashboard), compatible with CAD data conversion, and optimizes production line balance.
Trace Monitor function: Real-time tracking of the mounting head status, recording data such as picking errors and identifying anomalies, locating problem feeders or nozzles, and facilitating rapid troubleshooting and process improvement.
Bad mark propagation: Receive bad mark information from upstream equipment (such as AOI), skip defective substrate areas, and reduce repeated inspection time.
Intelligent scheduling: Automatically trigger the replenishment warning according to the component consumption, and link with the automated warehousing system to achieve uninterrupted production.
Low-impact placement parameter configuration: For flexible circuit boards or micro components, adjust the nozzle pressing speed and pressure separately to avoid substrate deformation or component damage.
Multi-language support: Provide English operation interface and manual, support remote monitoring and fault diagnosis (optional accessories required).

Power supply and air source system
Input voltage: three-phase AC 200V/220V/430V (220V-430V requires a separate transformer), apparent power 2.1kVA, low power consumption design adapts to energy-saving production needs.
Air source requirements
Air pressure: 0.5±0.05MPa, standard air consumption 20L/min ANR (during normal operation), support stable component picking and placement.