RX-6B | High-Speed Compact Modular Mounter

Name: RX-6B | High-Speed Compact Modular Mounter - Nectec
Price: 9999.00 USD
Availability: InStock

The compact RX-6R/RX-6B offers high productivity, flexibility and quality – in a compact footprint.
This is applicable to dual-lane production.Compact footprint : the width is just 1.25m.Equipped with standard Placement Monitor check function.Replaceable head allow you to configure a production line best suited to the current repirments.High-speed component placement using high-speed non-stop vision recognition.Wide range of components and boards: tall components, large components and large boards.Brand new Matrix Tray Sever TR8S improves the component capability and productivity.

Category: Juki

Description

Description

Mounting Head System

Multi-Nozzle Placement Architecture

Dual Head Configurations: Offers 6-nozzle and 3-nozzle mounting heads for quick changeover, supporting mixed placement of chip components and large ICs. Front-rear head collaboration reduces motion loss, achieving theoretical throughput of 42,000 CPH (chip components) and 14,000 CPH (IC components) per IPC-9850 standards.
Adaptive Force Modulation: 0.5N–50N dynamic pressure control accommodates sensitive components (e.g., LEDs) and PoP (package-on-package) assemblies.
Laser Metrology System (LNC): Inspects 0402 (01005 imperial) to 33.5mm square components with ±40μm accuracy (Cpk≥1), monitoring real-time X/Y position and Z-height.
MNVC Vision Module: Supports 3–100mm square and 50×180mm odd-form components (e.g., long connectors) with ±30μm accuracy (high-resolution camera optional).

Feeder System

Versatile Feeding Platform

RF Feeder Technology: Standard dual-track powered feeders support 8–56mm tape, with 160-station capacity (8mm tape equivalent), compatible with tube/tray and JEDEC-standard components.
Intelligent Feeding: Automatic tape splicing and real-time shortage alerts minimize manual intervention, enhancing production continuity.

PCB Processing System

Modular Substrate Handling

Single/Dual Track Capability:
- Single-track: 50×50mm–610×590mm PCBs
- Dual-track: 50×50mm–360×250mm PCBs
Long-Board Extension: Two-stage clamping supports up to 905×590mm substrates for LED panel and large PCB production.
Motorized Support Platform: Reduces transport vibration and shortens clamping time for improved placement stability.

Vision & Inspection System

Advanced Metrology Solutions

In-Flight Vision: Component recognition during head transit reduces idle time and optimizes throughput.
Pick-and-Place Verification: Real-time imaging of pickup and placement events prevents defect propagation and enables rapid fault diagnosis.
Optional 3D Inspection: Detects component coplanarity and height deviations to mitigate cold solder and tombstoning defects.

Motion Control System

High-Precision Mechanics

Linear Motor Drives with Magnetic Levitation: X/Y axes achieve sub-micron resolution via 0.001mm magnetic scales, ensuring stability at high speeds.
Dual-Servo Y-Axis Actuation: Optimizes conveyor dynamics to reduce mechanical vibration and enhance placement repeatability.

Intelligent Software & Scalability

JaNets Production Management Suite

Offline Programming: CAD import, trajectory optimization, and simulation reduce changeover time via intelligent path planning.
Modular Integration: TR8S matrix tray server enhances odd-form component handling; compatible with JUKI RX-7 series for flexible line configuration.

specification

High-Speed Compact Modular Mounter
Specifications			RX-6		RX-6B
Board size	single lane conveyor		50Ｘ50～610Ｘ590　/　905X590mm(2times clamping)
	dual lane conveyor		50×50～360×250㎜ Single lane conveyor specification mode max 360 × 450 mm
Component height			6/12/20/25/33mm
Component size	Laser recognition		0402～□50mm		0402～□33.5mm(3 nozzle head) 0402～□50㎜(6 nozzle head)

	Vision recognition	Standard camera (optional)	□3～□33.5mm		□3～□100mm/50×180mm
		High-resolution camera	1005～□20mm		1005～□48mm/24×72mm
Placement speed	Chip	Optimumwhen using the single lane conveyor specification	42,000CPH		34,000CPH
		IPC9850	26,000CPH		23,000CPH
	IC*[note]		14,000CPH		11,000CPH
Placement accuracy	Laser recognition		±0.04mm(Cpk≧1)
	Vision recognition(optional)		±0.04mm		±0.04mm
Component loading quantity			Max.160 in case of 8mm tape feeder (on a Electonic double tape feeder))

Component recognition Camera(VCS)			Standard	Option	Standard	Option
Placement monitor Inspection function			Standard	Option	Standard	Option
Auto tape cutter			Standard	Option	Standard	Option
Nozzle			Standard	Option	Standard	Option
Force control			Standard	Option	Standard	Option
Virus measurement Software(white list)			Standard	Standard	Standard	Standard
The IC note: Placement speed of IC components is estimated value when placing 36 pieces QFP component (dimension 10mm square or smaller) on M size PWB overall,picking from both front and rear side with all nozzles simultaneously.