Description

Placement Head & Laser Metrology System

• 8-Nozzle Parallel Placement Head (RS-1XL):
  Features parallel 8-nozzle architecture for synchronous pick-and-place operations, accommodating 50×150mm large-form components (e.g., heat sinks, connectors) and enabling mixed placement of micro-components to large devices without head changeover.
• Dual-Axis Actuation Technology:
  Optimizes nozzle Z-axis motion control for enhanced placement stability and throughput efficiency.
• Adaptive Pressure Modulation:
  Automatically adjusts placement force based on component mass/dimensions to prevent die cracking or PCB damage.
• LNC Series Laser Profilometry:
  Real-time height and positional inspection of 0402 (0.4×0.2mm) to 50×150mm components with ±50μm accuracy (Cpk≥1), suitable for QFP/BGA complex packages.

Feeder System

• RF Powered Feeder Platform:
  Supports 8–56mm tape feeders, tube/tray components, with 120-station capacity (8mm tape equivalent).
• Intelligent Feeding Technology:
  Incorporates automatic tape splicing and real-time shortage alerts to minimize manual intervention and sustain continuous production.

PCB Processing Capabilities

• Large-Format Substrate Handling:
  Standard 650×560mm PCB compatibility, optimized for LED panel and industrial control board production.
• Modular Conveyor Extension:
  Supports ultra-long substrates (up to 1,200×370mm) via scalable track configuration for diversified production needs.
• Motorized Support Surface:
  Reduces substrate vibration during transport through dynamic clamping, enhancing placement accuracy and reducing fixturing time.

Motion Control System

• Y-Axis Linear Motor Drive:
  Delivers high-speed motion with optimized acceleration profiles and sub-micron positioning, minimizing mechanical resonance.
• Dual-Servo X-Axis Actuation:
  Synchronized left/right servo motors ensure stability during long-stroke (650mm) placement head movement.

Software & Intelligent Functions

• JaNets Production Orchestration:
  Enables seamless line integration (e.g., with RX series equipment), real-time production data analytics, program optimization, and predictive fault diagnostics to enhance overall equipment efficiency (OEE).
• Offline Programming Suite:
  CAD-to-path conversion via HLC software with placement trajectory optimization and simulation debugging to reduce changeover time.
• CPK Compliance Calibration:
  Automatic offset compensation using glass calibration fixtures to maintain long-term placement accuracy via process capability verification.