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RO-8840 | Lead Free Reflow Oven
Eight Temperature zone Ring lead-free reflow Soldering, suitable for one-rail/dual-rail/nitrogen Soldering, supporting single-track boards with a maximum width of 511mm or dual-track boards with a width of 411mm×411mm. Equipped with efficient heating system, intelligent transport structure and flexible cooling configuration, compatible with ERP/MES system.
RS-1R | Smart Fast Modular Mounter
The consistent further development of the tried-and-tested technologies from the RS-1R opens up new, outstanding possibilities: Even faster assembly of smallest chips (0201 metric) up to large components of 50 x 150 mm or 74 mm edge length for square components. The base frame of the RS-1R has been completely redesigned for this purpose. The unique Takumi head covers even more different component heights and thus achieves a decisive speed advantage. The 360° visual component recognition allows the secure detection of user-specific polarity marks. Thanks to the RFID integration in the nozzles, these can be traced back completely together with the components and boards. The machine combines the features of a chip shooter with a mounter for large components. The purchase of each special machine type for it eliminates as well as a change of the placement head.
RS-1XL | Fast Smart Modular Mounter
With maximum speed up to 42,000CPH (Optimum) and 29,000CPH (IPC9850), the RS-1XL is designed for maximum throughput. The RS-1XL supports components from 0201 metric (008004") up to 74mm square and 50mm x 150mm rectangular parts for maximum flexibility.
RX-6B | High-Speed Compact Modular Mounter
The compact RX-6R/RX-6B offers high productivity, flexibility and quality – in a compact footprint. This is applicable to dual-lane production.Compact footprint : the width is just 1.25m.Equipped with standard Placement Monitor check function.Replaceable head allow you to configure a production line best suited to the current repirments.High-speed component placement using high-speed non-stop vision recognition.Wide range of components and boards: tall components, large components and large boards.Brand new Matrix Tray Sever TR8S improves the component capability and productivity.
RX-8 | High -Speed Compact Modular Mounter
JUKI RX-8 achieves ultra-high speed (100,000 CPH) and high precision (±40μm) micro-component placement through P20 placement head, high-precision vision system and intelligent feeding management, which is especially suitable for high-density placement scenarios such as consumer electronics and LED lighting. Its compact design and JaNets system support efficient production line integration and process optimization, and is a benchmark for SMT equipment that takes into account speed, precision and flexibility.
RX-8 | High -Speed Compact Modular Mounter
JUKI RX-8 achieves ultra-high speed (100,000 CPH) and high precision (±40μm) micro-component placement through P20 placement head, high-precision vision system and intelligent feeding management, which is especially suitable for high-density placement scenarios such as consumer electronics and LED lighting. Its compact design and JaNets system support efficient production line integration and process optimization, and is a benchmark for SMT equipment that takes into account speed, precision and flexibility.
S10 | 3D Hybrid Universal Module Placement Machine
The S10 model has 3D placement capabilities. It can realize 3D placement with interactive solder paste dispensing and component placement through the newly developed interchangeable dispensing head; it can be expanded to 3D MID placement, and can operate on concave and convex, inclined and curved surfaces to meet the needs of automotive, medical, communication equipment and other fields. It can handle large and long substrates with a maximum size of L1,330 x W510mm (when the buffer function is not used), and can be accurately positioned by laser sensors to adapt to PCBs of different shapes and sizes. It also has a variety of component processing: it can handle components from 0201mm to 120 x 90mm, including BGA, CSP, connectors, etc.; the maximum component height is 30mm (including substrate thickness); the maximum feeder capacity is 90 types (converted to 8mm tape), and supports multiple feeding methods. Its placement speed and accuracy have reached 0.08 seconds/CHIP (45,000CPH) under the best conditions for 12-axis 20-head unit, CHIP placement accuracy ±0.040mm, IC placement accuracy ±0.025mm, and placement angle ±180 degrees. Its equipment size is L1,250 x D1,750 x H1,420mm and weighs about 1,200kg. It also has negative pressure and image dual component return detection function and color reference mark recognition camera with new lighting unit to improve recognition accuracy; and supports multi-language operation interface. Its feeder compatibility is strong, and new and existing material change trolleys can be mixed and used.
S20 | 3D Hybrid Universal Placement Machine
The Yamaha S20 fulfills the need for higher throughput in the flexible assembly and LED lighting sectors. The new high capacity head system addresses the need for faster cycle times and provides ultra-large PCB handling capabilities with higher placement rates. The highly flexible S20 is available with the new head system incorporating 12 spindles with a wide component handling range. The S20 utilises the same fast change feeder bank and tray handler capabilities as the popular M20 and has a feeder capacity of up to 180 feeder positions. The optional camera will allow placement of parts down to 0.2 x 0.1 mm fulfilling the current demands on reduced component and ball sizes.
SIPLACE CA2 | Hybrid Mounter
As a hybrid combination of an SMT placement machine and a die bonder, the new SIPLACE CA2 can process both SMDs supplied from changeover tables and feeders as well as dies taken directly from the sawn wafer in a single work step. By integrating the complex die bonding process into the SMT line, it eliminates the need for special machines in production. With reduced personnel deployment, high connectivity, and integrative data utilization, the SIPLACE CA2 is therefore the perfect match for the Intelligent Factory.
SIPLACE X S | High-speed placement
The SIPLACE X S is benchmark in high-volume production. Absolute precision and maximum performance have made the SIPLACE X S the placement platform of choice for demanding high-volume production applications such as network infrastructure (5G), large boards for server and industrial segments. Wherever top speed, lowest dpm rates, non-stop setup changeovers, fast new product introductions and the high-speed placement of the latest generations of super-small components (0201 metric) are needed.
SIPLACE-SX | Cantilever modular placement machine
SIPLACE SX is the first placement solution that is fully scalable with demand thanks to its unique interchangeable gantries. A great way to add capacity when needed or reduce capacity when things slow down. We call it ASMPT Capacity-on-Demand.The SIPLACE SX-Series puts scalability and flexibility at the top of the list. Users are able to introduce new products quickly, change setups without stopping the line and produce any batch size with high utilization and efficiency.Whether in automotive, automation, medical, telecommunication or IT infrastructure – the ASMPT SX-Series meets all requirements in terms of quality, process reliability and speed.
SIPLSCE TX | High Speed Component Placement Machine
The compact SIPLACE TX modules make it very easy to scale your lines up or down. Optimizing each line is less of an undertaking, because getting the perfect balance between requirements and the number of machines is easier than ever.No matter with how many modules you start your line – you can increase its performance in steps of just 1 meter (3.3 feet) or 78,000 cph by adding more SIPLACE TX modules.Maximum accuracy – guaranteed Extremely fast and accurate: With up to 22 µm at 3 sigma, the new SIPLACE TX modules operate with top accuracy.Technological breakthrough: The SIPLACE TX is capable of placing super-fine-pitch 0201 (metric) components at highest speed.This unique combination of accuracy and record-breaking speed makes the SIPLACE TX the clear winner in the race for high-volume 0201 placements.But that‘s not all. No matter how many components you place, our improved control and head technologies protect the machine’s performance and accuracy for years to come.Extremely powerful and designed for the high-volume placement of future component generations, the SIPLACE TX modules deliver the level of investment protection electronics manufacturer want and need for their Smart SMT Factory.
