NPM-W2 | Modular Chip Mounter

The NPM-W2 amplifies the original NPM-W capabilities with a 10% throughput boost and 25% more accuracy. It also integrates new innovations like our incomparable Multi Recognition Camera. Combined, these features extend the component range down to the 03015mm microchip, yet preserve capability up to 120x90mm components up to 40mm tall and nearly 6” long (150mm) connectors.
Featuring a revolutionary Multi Recognition Camera that uniquely combines three separate imaging capabilities into a single system: 2D alignment, component thickness inspection, and 3D coplanarity measurement.

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NPM-W2 | Modular Chip Mounter

In stock

Description

Mounting head system
8-nozzle mounting head: highly versatile, suitable for standard component mounting tasks, and can quickly complete the mounting of a large number of components. The mounting speed is 18,000cph (0.20s/chip) in PC size and 17,460cph (0.21s/chip) in M ​​size, and the mounting accuracy can reach ±40μm/chip (Cpk≥1), which can meet the high-precision mounting requirements of general standard components.
3-nozzle mounting head V2: Maximum mounting pressure is 100N, optimized for mounting special-shaped components, with strong adaptability and high precision. When mounting QFP components, the accuracy can reach ±30μm/QFP (Cpk≥1), and it can handle components with sizes from 0603 chip to L 150 x W 25 (diagonal 152) x T 30.

 Visual recognition system

It adopts a multi-functional recognition camera, which integrates multiple functions and has strong recognition and inspection capabilities in the height direction of components. It can realize high-speed and high-precision identification. Whether it is special-shaped components or tiny components, it can stably and efficiently complete the identification work, ensure the accuracy of component placement position, and improve the overall placement accuracy and efficiency.

Feeding system
Multiple feeding methods: support multiple feeding methods such as tape, tray, and bar. When feeding with tape, the applicable tape width is 4 – 56/72/88/104mm; in terms of tray feeding, the front and rear tray feeders support a maximum of 40 (20 front/rear); when feeding with bar materials, the front and rear tray feeders support a maximum of 12 single bar feeders, and the front and rear feeder carts support a maximum of 28 single bar feeders.
Flexible supply unit configuration: The specifications of the supply unit can be selected and changed. By reorganizing the tray feeder or exchanging the trolley, it can easily meet the production needs of different component supply forms, shorten the line change time, and improve the adaptability of the production line. For example, the “Feeder cart batch exchange” system is convenient for rapid switching when producing different products and different component types.

PCB processing system
Dual-track and single-track mode: In single-track mode, the PCB size is 50×50L ~ 510×590L (PC size) or 50×50L ~ 510×510L (M size); in dual-track mode, the PCB size is 50×50L ~ 510×300L (PC size) or 50×50L ~ 510×260L (M size).
Fast substrate replacement: In dual-track mode, the substrate replacement time can theoretically reach 0 seconds (no 0-second delay when the cycle time is 4.0 seconds or less); in single-track mode, when there is no component on the back of the substrate, the substrate replacement time is 4.0 seconds.

Other auxiliary systems
Automatic warehouse and continuous production: Support automatic warehouse, combined with non-stop line change and independent placement functions, continuous production can be achieved and production efficiency can be improved. Offline settings in single-track mode are combined with setting navigation and trolley replacement to achieve non-stop line change.
Intelligent management and maintenance (partially optional): The automatic support pin replacement function can realize the automatic replacement of the support pin position, reducing the tediousness and errors of manual operation; the equipment also supports the switching of various component supply forms and the adjustment of equipment configuration, providing users with convenient and efficient production solutions. In addition, it also provides maintenance notification services, such as uploading machine information to the cloud, identifying feeders and nozzles that need to be checked, and sending maintenance inspection recommendation lists to customers.

specification

Model ID

NPM-W2

Front head Rear head

Lightweight 16-nozzle head V3A

12-nozzle head

Lightweight 8-nozzle head

3-nozzle head V2

Dispensing head

No head

Lightweight 16-nozzle head V3A 12-nozzle head

NM-EJM7D

NM-EJM7D-MD

NM-EJM7D

Lightweight 8-nozzle head

3-nozzle head V2

Dispensing head

NM-EJM7D-MD

NM-EJM7D-D

Inspection head

NM-EJM7D-MA

NM-EJM7D-A

No head

NM-EJM7D

NM-EJM7D-D

PCB dimensions

Single-lane1

Batch mounting

L 50 mm X W50 mm to L 750 mm X W 550 mm

2-positin mounting

L 50 mmxW50 mm to L 350 mmXW550 mm

Dual-lane·1

Dual transfer(Batch)

L 50 mm xW50 mm to L750mm XW260 mm

Dual transfer(2-positin)

L 50 mm xW50 mm to L350 mm xW260 mm

Single transfer(Batch) | L 50 mm xW50 mm to L750 mm x W510 mm

Single transfer(2-positin)

L 50 mm X W50 mm to L 350 mmX W 510 mm

Electric source

3-phase AC 200,220,380,400,420,480V 2.8 kVA

Pneumatic source ·

0.5 MPa、200L/min(A.N.R.)

Dimensions·

W1 280mmX D 2 465mmxH1 444mm /W 1 280 mmx D 2323 mmx H 1 444 mm *5

Mass

2 850 kg**

/ 2 780 kg *5

Placement head

Lightweight 16-nozzle head V3A ( Per head)

12-nozzle head ( Per head)

Lightweight 8-nozzle head ( Per head )

3-nozzle head V2 ( Per head )

High production mode [ON]

High production mode [OFF]

High production mode [ON]

High production mode [OFF]

Placement speed *at optimum conditions

42 000 cph(0.086s/chip

35 000 cph (0.103 s/chip)

32 250 cph (0.112s/chip)

31 250 cph(0.115s/chip)

20 800 cph(0.173 s / chip)

8 320 cph (0.433 s / chip) 6 500 cph(0.554 s /QFP)

Placement accuracy (Cpk≥1) *at optimum conditions

±40 μm/ chip

±30μm/ chip (±25μm/chips)

±40 μm/ chip

±30μm/ chip

±30μm/chip ±30μm/QFP-7

±30 μm/QFP

Component dimensions(m)

0402-achip toL85xW85xT3/T6∞

03015**/0402≤chip to L8.5xW8.5xT3/T6

0402-≥chip to L 12 xW 12 x T 6.5

0402-achip

0603 chip to L120xW90xT30/T4011

to L 45 x W 45 x T 12 or

or L150XW25XT30/T40mm

L 100 x W 40 x T 12

or L 135 xW 135 xT 13 12

Component supply

Taping

Tape:4/8/12/16/24/32/44/56mm

Tape:4 to 56/72mm

Tape:4 to 56/72/88/104mm

Stick

Max.30(Single stick feeder)

Tray

Max.40(Twin tray feeder)

Dispensing head

Dot dispensing

Draw dispensing

Dispensing speed

0.16 s/ dot(Condition:XY=10 mm,Z=less than 4 mn movement, No θ rotation)

4.25 s/component (Condition:30 mmx30mm corner dispensing)*4

Adhesive position accuracy(Cpk≥1)-13

±75μm/ dot

±100μm/ component

Applicable components

1608 chip to SOP,PLCC,QFP,Connector,BGA,CSP

BGA、CSP

Inspection head

2D inspection head (A )

2D inspection head (B)

Resolution

18 μm

9μm

View size

44.4mmx 37.2 mm

21.1 mm x 17.6mm

Inspection

Sold er Inspection-s

0.35 s / View size

processing

Component Inspection. 16

0.5 s / View size

time *15

Inspection object

Solder Inspection –

Chip component:100 μm x 150 μm or more (0603 or more) Package component :150 μ m or more

Chip component: 80 μmx120 μm or more (0402 or more) Package component: φ120 μm or more

Component Inspection

Square chip (0603 or more),SOP,QFP (a pitch of 0.4 mm or more), CSP,BGA,Aluminum electrolysis capacitor, Volume, Trimmer,Coil,Connector·

Square chip (0402 or more),SOP,QFP (a pitch of 0.3 mm or more), CSP,BGA,Aluminum electrolysis capacitor, Volume,Trimmer, Coil, Connector·v

Inspection items

Sold er Inspection –

Oozing, blur, misalignment, abnormal shape, bridging

Component Inspection .1 s

Missing, shift, flipping, polarity, foreign object inspection+18

Inspection position accuracy (Cpk&1)-9 *at optimum conditions

±20 μm

±10μm

No. of inspection

Solder Inspection-s Component Inspection -16

Max.30 000 pcs ./machine(No.of components: Max.10 000 pcs./machine) Max.10 000 pcs./ machine

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