

NPM-W2 | Modular Chip Mounter
The NPM-W2 amplifies the original NPM-W capabilities with a 10% throughput boost and 25% more accuracy. It also integrates new innovations like our incomparable Multi Recognition Camera. Combined, these features extend the component range down to the 03015mm microchip, yet preserve capability up to 120x90mm components up to 40mm tall and nearly 6” long (150mm) connectors.
Featuring a revolutionary Multi Recognition Camera that uniquely combines three separate imaging capabilities into a single system: 2D alignment, component thickness inspection, and 3D coplanarity measurement.

NPM-W2 | Modular Chip Mounter
- Description
Description
Mounting head system
8-nozzle mounting head: highly versatile, suitable for standard component mounting tasks, and can quickly complete the mounting of a large number of components. The mounting speed is 18,000cph (0.20s/chip) in PC size and 17,460cph (0.21s/chip) in M size, and the mounting accuracy can reach ±40μm/chip (Cpk≥1), which can meet the high-precision mounting requirements of general standard components.
3-nozzle mounting head V2: Maximum mounting pressure is 100N, optimized for mounting special-shaped components, with strong adaptability and high precision. When mounting QFP components, the accuracy can reach ±30μm/QFP (Cpk≥1), and it can handle components with sizes from 0603 chip to L 150 x W 25 (diagonal 152) x T 30.
Visual recognition system
It adopts a multi-functional recognition camera, which integrates multiple functions and has strong recognition and inspection capabilities in the height direction of components. It can realize high-speed and high-precision identification. Whether it is special-shaped components or tiny components, it can stably and efficiently complete the identification work, ensure the accuracy of component placement position, and improve the overall placement accuracy and efficiency.
Feeding system
Multiple feeding methods: support multiple feeding methods such as tape, tray, and bar. When feeding with tape, the applicable tape width is 4 – 56/72/88/104mm; in terms of tray feeding, the front and rear tray feeders support a maximum of 40 (20 front/rear); when feeding with bar materials, the front and rear tray feeders support a maximum of 12 single bar feeders, and the front and rear feeder carts support a maximum of 28 single bar feeders.
Flexible supply unit configuration: The specifications of the supply unit can be selected and changed. By reorganizing the tray feeder or exchanging the trolley, it can easily meet the production needs of different component supply forms, shorten the line change time, and improve the adaptability of the production line. For example, the “Feeder cart batch exchange” system is convenient for rapid switching when producing different products and different component types.
PCB processing system
Dual-track and single-track mode: In single-track mode, the PCB size is 50×50L ~ 510×590L (PC size) or 50×50L ~ 510×510L (M size); in dual-track mode, the PCB size is 50×50L ~ 510×300L (PC size) or 50×50L ~ 510×260L (M size).
Fast substrate replacement: In dual-track mode, the substrate replacement time can theoretically reach 0 seconds (no 0-second delay when the cycle time is 4.0 seconds or less); in single-track mode, when there is no component on the back of the substrate, the substrate replacement time is 4.0 seconds.
Other auxiliary systems
Automatic warehouse and continuous production: Support automatic warehouse, combined with non-stop line change and independent placement functions, continuous production can be achieved and production efficiency can be improved. Offline settings in single-track mode are combined with setting navigation and trolley replacement to achieve non-stop line change.
Intelligent management and maintenance (partially optional): The automatic support pin replacement function can realize the automatic replacement of the support pin position, reducing the tediousness and errors of manual operation; the equipment also supports the switching of various component supply forms and the adjustment of equipment configuration, providing users with convenient and efficient production solutions. In addition, it also provides maintenance notification services, such as uploading machine information to the cloud, identifying feeders and nozzles that need to be checked, and sending maintenance inspection recommendation lists to customers.
specification
Model ID | NPM-W2 | ||||||||||
Front head Rear head | Lightweight 16-nozzle head V3A | 12-nozzle head | Lightweight 8-nozzle head | 3-nozzle head V2 | Dispensing head | No head | |||||
Lightweight 16-nozzle head V3A 12-nozzle head | NM-EJM7D | NM-EJM7D-MD | NM-EJM7D | ||||||||
Lightweight 8-nozzle head | |||||||||||
3-nozzle head V2 | |||||||||||
Dispensing head | NM-EJM7D-MD | NM-EJM7D-D | |||||||||
Inspection head | NM-EJM7D-MA | NM-EJM7D-A | |||||||||
No head | NM-EJM7D | NM-EJM7D-D | |||||||||
PCB dimensions | Single-lane1 | Batch mounting | L 50 mm X W50 mm to L 750 mm X W 550 mm | 2-positin mounting | L 50 mmxW50 mm to L 350 mmXW550 mm | ||||||
Dual-lane·1 | Dual transfer(Batch) | L 50 mm xW50 mm to L750mm XW260 mm | Dual transfer(2-positin) | L 50 mm xW50 mm to L350 mm xW260 mm | |||||||
Single transfer(Batch) | L 50 mm xW50 mm to L750 mm x W510 mm | Single transfer(2-positin) | L 50 mm X W50 mm to L 350 mmX W 510 mm | |||||||||
Electric source | 3-phase AC 200,220,380,400,420,480V 2.8 kVA | ||||||||||
Pneumatic source · | 0.5 MPa、200L/min(A.N.R.) | ||||||||||
Dimensions· | W1 280mmX D 2 465mmxH1 444mm /W 1 280 mmx D 2323 mmx H 1 444 mm *5 | ||||||||||
Mass | 2 850 kg** | / 2 780 kg *5 | |||||||||
Placement head | Lightweight 16-nozzle head V3A ( Per head) | 12-nozzle head ( Per head) | Lightweight 8-nozzle head ( Per head ) | 3-nozzle head V2 ( Per head ) | |||||||
High production mode [ON] | High production mode [OFF] | High production mode [ON] | High production mode [OFF] | ||||||||
Placement speed *at optimum conditions | 42 000 cph(0.086s/chip | 35 000 cph (0.103 s/chip) | 32 250 cph (0.112s/chip) | 31 250 cph(0.115s/chip) | 20 800 cph(0.173 s / chip) | 8 320 cph (0.433 s / chip) 6 500 cph(0.554 s /QFP) | |||||
Placement accuracy (Cpk≥1) *at optimum conditions | ±40 μm/ chip | ±30μm/ chip (±25μm/chips) | ±40 μm/ chip | ±30μm/ chip | ±30μm/chip ±30μm/QFP-7 | ±30 μm/QFP | |||||
Component dimensions(m) | 0402-achip toL85xW85xT3/T6∞ | 03015**/0402≤chip to L8.5xW8.5xT3/T6 | 0402-≥chip to L 12 xW 12 x T 6.5 | 0402-achip | 0603 chip to L120xW90xT30/T4011 | ||||||
to L 45 x W 45 x T 12 or | or L150XW25XT30/T40mm | ||||||||||
L 100 x W 40 x T 12 | or L 135 xW 135 xT 13 12 | ||||||||||
Component supply | Taping | Tape:4/8/12/16/24/32/44/56mm | Tape:4 to 56/72mm | Tape:4 to 56/72/88/104mm | |||||||
Stick | Max.30(Single stick feeder) | ||||||||||
Tray | 二 | Max.40(Twin tray feeder) | |||||||||
Dispensing head | Dot dispensing | Draw dispensing | |||||||||
Dispensing speed | 0.16 s/ dot(Condition:XY=10 mm,Z=less than 4 mn movement, No θ rotation) | 4.25 s/component (Condition:30 mmx30mm corner dispensing)*4 | |||||||||
Adhesive position accuracy(Cpk≥1)-13 | ±75μm/ dot | ±100μm/ component | |||||||||
Applicable components | 1608 chip to SOP,PLCC,QFP,Connector,BGA,CSP | BGA、CSP | |||||||||
Inspection head | 2D inspection head (A ) | 2D inspection head (B) | |||||||||
Resolution | 18 μm | 9μm | |||||||||
View size | 44.4mmx 37.2 mm | 21.1 mm x 17.6mm | |||||||||
Inspection | Sold er Inspection-s | 0.35 s / View size | |||||||||
processing | Component Inspection. 16 | 0.5 s / View size | |||||||||
time *15 | |||||||||||
Inspection object | Solder Inspection – | Chip component:100 μm x 150 μm or more (0603 or more) Package component :150 μ m or more | Chip component: 80 μmx120 μm or more (0402 or more) Package component: φ120 μm or more | ||||||||
Component Inspection | Square chip (0603 or more),SOP,QFP (a pitch of 0.4 mm or more), CSP,BGA,Aluminum electrolysis capacitor, Volume, Trimmer,Coil,Connector· | Square chip (0402 or more),SOP,QFP (a pitch of 0.3 mm or more), CSP,BGA,Aluminum electrolysis capacitor, Volume,Trimmer, Coil, Connector·v | |||||||||
Inspection items | Sold er Inspection – | Oozing, blur, misalignment, abnormal shape, bridging | |||||||||
Component Inspection .1 s | Missing, shift, flipping, polarity, foreign object inspection+18 | ||||||||||
Inspection position accuracy (Cpk&1)-9 *at optimum conditions | ±20 μm | ±10μm | |||||||||
No. of inspection | Solder Inspection-s Component Inspection -16 | Max.30 000 pcs ./machine(No.of components: Max.10 000 pcs./machine) Max.10 000 pcs./ machine | |||||||||
