



Wave Solder Infeed and Outfeed Conveyor | PCB Handing Conveyor
The Wave Solder Infeed and Outfeed Conveyor is designed for efficient PCB transport during wave soldering processes. It features durable construction for reliable operation, adjustable speed control for optimal handling, and safety sensors to protect operators. With a user-friendly interface and SMEMA compatibility, this conveyor seamlessly integrates into existing production lines, ensuring smooth transitions for PCBs before and after soldering.

Wave Solder Infeed and Outfeed Conveyor | PCB Handing Conveyor
- Description
Description
Precision Process Integration
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Thermal Profile Synchronization: Speed-adjustable controls synchronize conveyor velocity (0.5–20 m/min) with wave solder immersion time, ensuring optimal wetting for through-hole and SMT assemblies. Tactile interface enables real-time adjustments during high-mix production.
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Dual-Zone Frame Engineering:
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Standard Rectangular Frame: Reinforced steel construction resists thermal warping at solder pot proximity (≤300°C ambient).
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Optional Aluminum Profile: Anodized T-slot extrusion reduces mass 40% while maintaining rigidity for inline height adjustments.
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Adaptive PCB Handling
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Tool-Less Width Adjustment: Hardened lead screws enable rapid track-width reconfiguration (50–530mm range), accommodating diverse PCB geometries without downtime. Parallel guide rails maintain ±0.2mm alignment tolerance.
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Dynamic Height/Z-Axis Calibration: Integrated scissor lifts synchronize PCB transport height (900±20mm) with solder wave dynamics, preventing shadowing or bridging. Outfeed conveyors include tilt compensation for drainage.
Transmission Efficiency
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Zero-Gap Chain Drive: 35B nylon chain links minimize board-to-track clearance (<1mm), eliminating edge snagging during high-speed transfers. Self-lubricating bushings extend service life in flux-laden environments.
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Anti-Drift Rail System: V-groove rollers constrain PCB lateral movement, critical for double-sided assemblies with bottom-side components.
Customization & Scalability
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Modular Length Variants: Infeed units (800mm depth) optimize pre-heat zone staging; outfeed models (1200mm) extend cooling duration. Bespoke lengths accommodate tandem soldering systems.
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High-Temp Component Selection: Motors and sensors rated for 80°C operation exceed J-STD-004 flux exposure requirements.
specification
Specification | ||||
Description | Delivery of PCBs entering wave soldering machine | |||
Conveyor type | 35B Nylon chain specified | |||
Conveyor speed | 0.5-20M/min (customer specified) | |||
Power supply | AC 110/220 volts; single phase | |||
Power | Max. 200VA | |||
Transport direction | L→R/R→L | |||
Dimension | ||||
Model | Dimension(L x W x H, mm) | PCB board size | Weight (kg) | |
CY-330WI | 800*600* 1100 | 50*50-445*330 | 35 | |
CY-460WI | 800*730*1100 | 50*50-530*460 | 45 | |
CY-445WO | 1200*480* 1250 | 50*50-445*330 | 35 | |
CY-530WO | 1200*730* 1100 | 50*50-530*460 | 45 |
