Description

Adaptive Defect Management System

• Tri-Mode Operational Logic:

  • Reject Mode: Automatically diverts non-conforming (NG) boards to a dedicated buffer lane upon AOI/SPI fault signal.

  • Inspect Mode: Pauses PCB flow for manual verification at ergonomic workstation height (900±20mm).

  • Bypass Mode: Maintains continuous production flow during maintenance or calibration cycles.

• Dynamic NG Buffer: Stores up to 5 PCBs in vertically staggered configuration (20mm inter-board clearance), enabling batch rework processing without line stoppage.

Robust Structural Engineering

• All-Welded Stainless Frame: 304-grade stainless steel construction with laser-cut reinforcements resists mechanical stress in 24/7 operation. Corrosion-resistant coating withstands flux/cleaning agents.

• Anti-Static Conveyance: Oblate belts (surface resistivity 10⁶–10⁹ Ω) dissipate electrostatic charge, preventing component damage during NG handling.

Customizable Production Integration

• Scalable Length Configurations: Modular sections support lengths from 500mm (CY-330R) to 1000mm (CY-530R), adapting to space-constrained or high-throughput lines.

• Multi-Tray Top Assembly: Configurable with 1–3 trays for simultaneous PCB staging, inspection, and component rework. Tool-less tray adjustment accommodates boards up to 530×460mm.

Precision Process Control

• Variable Speed Drive: Stepper motor-controlled belt system enables 0.5–20 M/min velocity tuning, synchronizing with upstream/downstream equipment cycle times.

• Step-Distance Calibration: 20mm incremental board stacking ensures collision-free storage, optimized for thicknesses down to 0.6mm.

Seamless Line Integration

• SMEMA/EAP Protocol Compliance: 24V I/O signaling triggers automatic rejection upon AOI/SPI fault detection. RS-485 interface supports MES connectivity for yield analytics.

• Thermal-Resistant Components: Bearings and sensors rated for 80°C ambient operation ensure reliability near reflow ovens.