

Automatic SMT PCB Magazine Type Buffer | PCB Handing Buffer
The Nectec Magazine Type Buffer is a high-efficiency PCB handling device designed for receiving NG boards or memory boards in SMT production lines. With six operational modes, advanced pneumatic clamping, and a PLC-controlled touchscreen, this system ensures precise and reliable PCB storage, reducing handling risks and optimizing workflow.

Automatic SMT PCB Magazine Type Buffer | PCB Handing Buffer
- Description
Description
Defect Management Architecture
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Post-SPI/AOI Isolation Buffer: Specialized for temporary storage of non-conforming (NG) boards identified by SPI or AOI systems, preventing defective PCBs from advancing downstream. The dual-magazine lower conveyor configuration provides segregated storage lanes for efficient NG/OK sorting.
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Dynamic NG/OK Pass-Through Logic: Integrated cached pass-through functionality allows immediate routing of conforming (OK) boards to subsequent processes while isolating NG boards. Bypass mode enables uninterrupted line flow during maintenance or buffer saturation.
Precision Conveyance & Control
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High-Precision Servo Positioning: Servo motor-driven indexing achieves positional accuracy ≤±0.1mm, ensuring repeatable retrieval during rework operations. This complements the “fast, smooth and accurate retrieval location” mechanism documented for high-throughput environments.
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Industrial-Grade Motion Components: Imported low-friction bearings (e.g., NSK/TBI referenced in major configurations) minimize roller transmission resistance, enabling smooth handling of boards up to 530×390mm without edge damage.
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Hardened Lead-Screw Width Adjustment: Manual parallel width adaptation via corrosion-resistant lead screws accommodates PCB sizes from 50×50mm to 530×390mm, maintaining alignment integrity under continuous operation.
Automation & Integration
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Mitsubishi PLC Intelligence: Programmable logic controller executes FIFO/LIFO/NG buffering algorithms with real-time diagnostics. Error codes display via the HMI to expedite troubleshooting.
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Unified SMEMA/EAP Signaling: Electrically compatible with AOI/SPI machines for automated board-status handshaking. Standardized 24V I/O and transport height (900±20mm) ensure plug-and-play integration.
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Sealed Touchscreen HMI: IP65-rated interface resists flux contamination and supports password-protected access for operational mode selection (FIFO/LIFO/Bypass) and capacity monitoring.
Robust Mechanical Design
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Dual-Layer Magazine Architecture: Upper conveyor (1 magazine) and lower conveyor (2 magazines) enable simultaneous processing of NG/OK boards, reducing handling time by 40% versus single-lane buffers.
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Pneumatic Clamping System: Tool-less magazine locking secures PCBs during vertical indexing, eliminating vibration-induced misalignment.
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Anti-Static Roller Transmission: Electrically grounded rollers dissipate static charge, protecting sensitive components during storage/retrieval.
specification
Specification | |||||
Description | Applied at the lower position of SPI to store PCB boards | ||||
Number of magazine | Upper conveyor: 1 magazine ;lower conveyor: 2 magazine | ||||
Indexing pitch | 10, 20, 30, 40mm (customer specified) | ||||
Power supply | AC 110/220 volts; single phase | ||||
Power | Max. 250VA | ||||
Air pressure and consumption | 4-6 bar; max. 15ltr/min | ||||
Transport height | 900 ± 20mm (customer specified) | ||||
Transport direction | L→R/R→L | ||||
Dimension | |||||
Model | Dimension(L × W × H, mm) | Dimension(L × W × H, mm) | PCB board size | Magazine size | Weight (kg) |
BF-250M | 1150*1150*1205 | 910*750*1600 | 50*50-350*250 | 355*320*565 | 150 |
BF-330M | 1350*1350*1205 | 1050*885*1600 | 50*50-445*330 | 460*400*565 | 175 |
BF-390M | 1550*1550*1205 | 1230*920*1600 | 50*50-530*390 | 535*460*565 | 195 |
