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Leaded Solder Paste
Nectec’s Lead Solder Paste provides a reliable and cost-effective solution for traditional electronic assembly processes, leveraging lead-based alloys to offer low melting points and robust soldering performance. With alloys like Sn63Pb37 and Sn62.9Pb36.9Ag0.2, the product ensures efficient wetting, minimal defects, and compatibility with diverse manufacturing techniques, from printing to reflow soldering. Ideal for industries requiring high-reliability joints—such as home appliances, automotive, and military electronics—it combines process adaptability with consistent quality, meeting the demands of legacy and high-volume production lines.
- Description
Description
specification
LEAD-FREE SOLDER PASTE | Solder paste model | Types of solder paste | Powder diameter | Applicable alloy | Usage | Welding method | Application |
VXG | ROL1 | Type4 Type5 Type6 Type7 | Sn96.5Ag3.0Cu0.5 Sn98.5Ag1.0Cu0.5 Sn99Ag0.3Cu0.7 | Printing | Reflow soldering | Suitable forsmart products 0201、 01005、Fine pitch IC devices | |
VHF | ROLO | Suitable for smart products 0201、 01005、Fine pitch IC devices | |||||
V3 | ROLO | Printing/ Dot Coating | Laser welding/ Haber welding/ Reflow welding | Suitable for electronic products such as flexible circuit boards (FPC),connectors, wireless chargers,optical | |||
VH | ROLO | Type3 Type4 Type5 | Sn96.5Ag3.0Cu0.5 Sn98.5Ag1.0Cu0.5 Sn99Ag0.3Cu0.7 Sn99.3Cu0.7Ni/Ge/Ag | Printing/ through-hole printing | Reflow soldering | Suitable for household appliances LED、 Ordinary electronic products such as appliances | |
VW | ROLO | Home appliances,internet LED、 Power supply and other products | |||||
VC | ROLO | 0.3BGA,0201,0.3IC and other precision products, smartphones,modules,etc | |||||
V4 | ROL1 | LED,heat sink,through-hole printing, low-temperature soldering process | |||||
WS | ROL1 | Suitable for products that require very clean surface, can be cleaned with alcohol or water | |||||
A6 | ROLO | Type3 Type4 Type5 | Sn42Bi58 Sn64Bi35Ag1.0 Sn64.7Bi35Ag0.3 | Printing/ Dot Coating | Reflow soldering | LED,heat sink,through-hole printing, low-temperature soldering process | |
VX | ROLO | Sn97.8Cu0.7Bi1.5 | |||||
VT | ROLO | Type4 | Sn96.5Ag3.0Cu0.5 | Printing | Reflow soldering | IGBT specific,suitable for high-speed printing and mounting processes | |
LEAD SOLDER PASTE | VG | RMA | Type3 Type4 | Sn63Pb37 Sn62.9Pb36.9Ag0.2 Sn62.8Pb36.8Ag0.4 | Printing/ Dot Coating/ through-hole printing | Reflow soldering | Meet the assembly process of various house hold appliances, networks, military, automotive communication, and LED series products. |
VR | RMA | ||||||
Halogen-Free Solder Paste | Model | Alloy Composition | Powder Size | Viscosity (pa.s) | Melting Point (°C) | ||
ASH SAC305VHF | SnAg3.0Cu0.5 | 4#, 5#, 6# | 200±30 | 217-220 | |||
GLH-980-VW | SnAg3.0Cu0.5 | 4#, 5#, 6# | 200±30 | 217-220 | |||
