Description

 Laser recognition system (LNC60)
Function: Equipped with LNC60 laser sensor, it supports on-the-fly centering recognition, and can detect component position, angle and size while the placement head is moving, covering 0402 (01005 in British system) to 33.5mm square components, including complex packages such as QFP, CSP, BGA, etc.
Placement accuracy: The accuracy in laser recognition mode reaches ±0.05mm (Cpk≥1), and the recognition speed is 20% higher than that of the previous generation model.
Real-time monitoring: Tracking and detection from component suction to placement ensures placement stability and reduces the risk of missing or wrong placement.

Placement head and nozzle design
Structure: A single placement head is equipped with 6 independent nozzles, supporting synchronous picking and placement, with a theoretical speed of 23,500 CPH (chip components) and 18,500 CPH and 9,000 CPH (IC components, MNVC image recognition module is required).
Dynamic pressure control: Automatically adjust the placement pressure according to the component type to adapt to components of different heights (6mm or 12mm) and sizes.

 Feeder system
Electric dual-track feeder (EF08HD): Supports 8mm tape feeders and can load up to 160 components (calculated based on 8mm tape feeders), which doubles the capacity of traditional models and significantly reduces line change time.
Hybrid compatibility: Both electric (ETF) and mechanical (CTF/ATF) feeders can be used to reduce upgrade costs.
Automatic material connection and material shortage warning: Continuous production is achieved through Smart Feeder technology, reducing manual intervention.

Motion control system
XY axis drive technology: Adopts new screw drive + high-precision linear magnetic scale (resolution 0.001mm), combined with full closed-loop control, to achieve high speed (acceleration optimization) and high-precision positioning, while reducing noise.
Dual servo Y-axis drive: Optimize track stability and reduce vibration during high-speed movement.

PCB processing system
Substrate compatibility: supports a variety of substrate sizes, including standard sizes (such as M-type 330×250mm, XL-type 610×560mm) and extended long-size substrates (maximum 1,210×560mm), suitable for the production of ultra-long PCBs such as LED light boards and displays.
Motor-driven support table: reduces vibration during substrate transmission, shortens fixing time, and improves mounting accuracy.

Software and intelligent functions
Operating system: Based on Windows XP (supports switching between Chinese, Japanese, and English), the interface is intuitive and easy to operate.
Offline programming software (JANETS): supports CAD import, path optimization and simulation, can generate programs offline and simulate debugging to improve production efficiency.
Real-time monitoring and diagnosis: built-in fault code library, real-time display of throw rate and mounting status, and support for integration with MES/ERP systems.