HM520 | Cutting-edge Modular Mounter

Introducing the HM520, Hanwha’s Cutting-edge Modular Mounter.It have 2 Gantries and 20 Spindles to achieve speed of 80000 CPH.The accuracy of the machine is about ±25 μm [Cpk ≥ 1.0 (Chip)].And its dimension is 890* 2,370*1,930(L*D*H,Unit: mm).

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HM520 Cutting-edge Modular Mounter

HM520 | Cutting-edge Modular Mounter

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Description

Placement Performance

  1. Throughput Capability:
    • Maximum placement speed: 80,000 CPH (ideal conditions), achieved via dual gantry architecture with 20 independent spindles in synchronized operation.
  2. Positional Accuracy:
    • Standard components (e.g., 0201): ±25μm (Cpk≥1.0)
    • IC components (e.g., QFP/BGA): ±30μm (Cpk≥1.0)
  3. Component Handling Range:
    • Supports 0201 metric (0.25×0.125mm) to 55×55mm components (max height 15mm), including microchips, LEDs, and fine-pitch packages (QFP/BGA).

Vision System

  1. In-Flight Vision Technology:
    • Real-time component recognition during head transit reduces idle time and enhances throughput efficiency.
  2. High-Resolution Imaging Module:
    • 5MP camera enables precise alignment of micro-components (e.g., 0402, 0603).
  3. Side View Inspection System:
    • Monitors nozzle condition and component orientation in real-time to prevent misplacement or omissions.
    • Optional 3D Laser Profiling: Detects component height and coplanarity to mitigate cold solder and tombstoning defects.

Feeder System

  1. Powered Feeder Platform:
    • Supports 8–56mm tape feeders, tube/tray components, with 120-station capacity (8mm tape equivalent).
  2. Intelligent Feeding Technology:
    • Automatic tape splicing and real-time material shortage alerts minimize manual intervention for uninterrupted production.

Motion Control System

  1. Dual Gantry Linear Motor Drives:
    • Micron-level X/Y axis resolution with vibration dampening algorithms ensures high-speed placement stability.
  2. Adaptive Force Modulation:
    • Dynamic pressure adjustment by component type prevents damage to sensitive devices (e.g., fine-pitch ICs).

Software & Intelligent Functions

  1. Dynamic Trajectory Optimization:
    • Auto-allocates component placement sequences to reduce gantry idle travel and enhance efficiency.
  2. Family-Based Changeover:
    • Shared feeder/nozzle libraries across similar machines reduce changeover time by 40% for 同族 products.
  3. Defect Mark Sharing:
    • Cross-equipment Badmark data sharing shortens overall production cycle by preemptively addressing recurring issues.

specification

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