Description

Mounting head and laser recognition system Structural design:
4 mounting heads (each with 6 nozzles), totaling 24 nozzles, support synchronous picking and mounting, and achieve high-speed operation.
Laser sensor (LNC60): The new laser sensor supports 6 nozzles to suck and automatically identify at the same time, and the recognition speed is 20% higher than the traditional 4 nozzles. It can cover 0402 (0.4×0.2mm) to 33.5mm square components,including complex packages such as QFP, CSP, BGA, etc., with a recognition accuracy of ±0.05mm (±3σ).
On-the-fly recognition: The mounting head completes component recognition during high-speed movement, reducing downtime and improving mounting efficiency.

Vision and motion control system
XY axis linear servo motor: The new linear servo motor drives the X/Y axis, combined with full closed-loop control and 0.001mm resolution linear magnetic scale to achieve high speed (acceleration improvement) and high-precision positioning.
Magnetic suspension linear motor technology: friction-free and wear-free design, long-term maintenance-free, long equipment life, and acceleration far exceeding traditional screw drive.
Dual servo Y-axis drive: optimizes track stability, reduces vibration during high-speed movement, and ensures placement accuracy.

 Feeder system
Mixed feeder specifications: supports the use of electric belt feeders and mechanical belt feeders on the same machine, and can load up to 240 components (calculated based on 8mm belt feeders).
Smart Feeder technology: The electric feeder supports automatic material connection and material shortage warning, reduces manual intervention, and improves production continuity.

PCB processing capabilities
Substrate size compatibility:Standard substrates: L substrates (410×360mm), XL substrates (610×560mm).
Extension options: supports long-size substrates (800×560mm), suitable for ultra-long PCB production such as LED lighting.
Substrate support system: Motor-driven support table to reduce vibration when releasing the substrate, prevent placement offset, and shorten substrate fixing time.

Software and operation interface
Real-time optimization algorithm: automatically allocate component placement paths, optimize production procedures, and achieve a theoretical speed of 90,000 CPH (optimal conditions).
15-inch touch screen:
Provides an intuitive operation interface, supports real-time monitoring of placement status, ejection rate and fault diagnosis.
Compatibility: Can be combined with JUKI KE series placement machines to form a production line, flexibly responding to diverse production needs.

Vacuum system and maintenance design
High vacuum pump: Reduce air consumption, improve component suction stability, and reduce ejection rate7.
Modular maintenance: Key components such as nozzles and feeders support quick replacement, and the electric feeder is lubrication-free and has low maintenance costs.
Summary of technical advantages
High speed and high precision: Linear servo motors combined with laser recognition technology achieve 90,000 CPH high-speed placement and ±0.05mm accuracy.
Strong scalability: Supports ultra-long substrates and mixed feeders, adapting to diverse scenarios such as LEDs and automotive electronics.
Low maintenance cost: Magnetic levitation drive and modular design reduce downtime and extend equipment life.