NX-EF | Electronics X-ray Inspection System

The NX-EF machine is applied to detect welding defects in electronic components. It is capable of inspecting PCB, SMT assembly, IC packaging, BGA (Ball Grid Array), CSP (Chip Scale Package), semiconductor and other components. With its advanced technology, it can accurately identify various welding issues, ensuring the quality and reliability of electronic products.

Category:

NX-EF | Electronics X-ray Inspection System

In stock

Description

Functions and Features

X-Ray Tube Configuration:Adopts sealed tube style X – ray tube, with 90kv tube voltage, 200uA tube current, 5um details resolution, air cooling mode, and 125 (times) geometric magnification time.

Flat Panel Detector Specs:Features flat panel detector with 85um pixel size, 15361536mm pixel matrix, 130130mm effective imaging area, 20 Fps, and 16bit AD conversion digits.

Motion Control Capability:Motion control system offers 340mm Axis X, 330mm Axis Y, 300mm Axis Z, and the fixture rotates 360 degrees for Axis R.
EXPB 001 Product info 1

specification

Note:The above information only represents general description and characteristics, which may change with technological advancement and equipment upgrades. Specific parameters are subject to the final agreement. The above information only represents general description and characteristics, which may change with technological advancement and equipment upgrades. Specific parameters are subject to the final agreement.

Item

Model

EXPB-001

X-Ray Tube

Tube Style

Sealed tube

Tube voltage

90kv

Tube current

200uA

Details resolution

5um

Cooling mode

Air Cooling

Geometric magnification time

125 (times)

Flat panel detector

Pixel size

85um

Pixel matrix

1536*1536mm

Effective imaging area

130*130mm

Fps

20

AD conversion digits

16bit

Motion Control System

Axis X

340mm

Axis Y

330mm

Axis Z

300mm

Axis R

The fixture rotates 360 degrees

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