Description

Conveying system
1. Supports multi-size PCBs (50×50mm to 510×460mm, optional expansion to 1200×460mm)2.
2. Magnetic suspension track technology ensures high-stability transmission.

Vision system
1. PCB positioning camera: Correct coordinates through Mark points,Fly Camera and Fix Camera.
2. Component centering camera: Identify component position and polarity, with accuracy supporting 03015 chips (0.3×0.15mm).
3. 3D laser detection (optional): Detect component height and coplanarity to prevent cold soldering.

Placement head
1. Dual cantilever structure: 10 independent spindles, support synchronous picking.
2. Dynamic pressure control: Adapt to different component thicknesses (up to 15mm), and the placement pressure is adjustable.
3. Automatic nozzle replacement: compatible with 7 standard nozzles + 9 optional nozzles.

Feeder system
1. Electric feeder (eFeeder): supports 8mm to 56mm tape feeders and tube/tray components.
2. Smart Feeder: automatic material receiving, 120 material station capacity.

Motion control system
1. Linear motor drive: X/Y axis resolution 2μm, placement accuracy ±25μm (IC components)2.
2. Vibration suppression technology: ensure stability under high-speed placement (up to 92,000 CPH).

Software and operating system
1. Real-time optimization of placement path, integrated SMEMA/SECS/GEM protocol, support MES/ERP system.
2. Automatic calibration and temperature compensation function.