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NX-CT160 | X-ray Inspection System
The NX-CT160 is a cutting-edge 3D X-ray inspection system specifically designed for advanced wafer technology, surface-mount technology (SMT), packaging inspection, and semiconductor applications in laboratory settings. It excels at detecting issues such as solder and tin voids, as well as bonding wire defects commonly found in SMT and semiconductor manufacturing. Additionally, the system effectively identifies packaging defects, including offsets, wire cross short circuits, flip-chip solder ball problems, wire breakage, and detachment.
- Description
Description
Functions and Features
Multi-angle image tracking system
The geometric magnification is up to 2100X
Six-axis linkage 360 degree arbitraryviewing angle detection
CNC(Computer Numerical control)programming positioning detection
specification
System Magnification and Resolution | |
Geometric magnification | 2100x |
Total magnification | >23000X |
Detail resolution | Up to 0.35 microns |
Submicron X-ray tube | |
Types | Open micron tube,transmission tube head,170 degree radiation Angle, colimator function |
Maximum tube voltage | 160KV |
Maximum power | 20W |
Target | Non-toxic carrier tungsten target and can be rotated for multiple users |
TAsnent | Tungsten wire, pre-tuned plug in structure, easy and quick to replace, within 20 minutes to complete |
Vacuum system | Oil-free low vacuum pump + turbomolecular vacuum pump |
Detector | 1536 1536pixel |
Control platform | X-ray automatic navigation system, can achieve intemal and extemal navigation |
Overent structure | High precision anti-vibration, 5-axis synchronous drive |
Maximum detection range | 410mm*410mm |
Maximum workdioce size/weight | 510mm*510mm/5kg |
Probe wnw trianglsview rotated | Adjustable viewing Angle 70 degree,n x360 degree |
Controls | Joystick control or mouse (manual mode) CNC programming Control(automatic mode) |
Control AIDS | X-ray image navigation map, click to move function, click to enlarge function, Automatically maintain the center of vision function, laser positioning and aiming |
Control AIDSisystem | Prevent the test sample from colliding with the ray tube |
Image processing software | |
ELT x|act base | Comprehensive X-ray image analysis software includes image contrast enhancement and fitering,measurement,CNC programming |
BGA mode | BGA solder joint automatic detection function |
VC mode | Automatic calculation of void area ratio, including multi-chip mounting void detection function |
System scale (WxHxD) | 1650mm*1680mm*1955mm (Excluding console and detachable rear extension) |
Ccrszte heig:t aadpnsiable | 320mm |
Maximum weight | About 3050kg |
Radiation safety protection | Safety shielding room with lead steel protective structure and lead glass Windows, in accordance with Geman and American safety design standards for X-ray equipment |
Radiation lnakage-dosa’orte | <1.0m Sv/h, in line with intemational standard |
Hardware options | |
Tlt/rotate gear | Tilt 70～ and rotate n x 360～ with a maximum workpiece weight of 5kg |
Laser posting device | Cross laser wire |
square non-rotiaing | Test area to 510mm*510mm |
