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NX-CT160 | X-ray Inspection System
The NX-CT160 is a cutting-edge 3D X-ray inspection system specifically designed for advanced wafer technology, surface-mount technology (SMT), packaging inspection, and semiconductor applications in laboratory settings. It excels at detecting issues such as solder and tin voids, as well as bonding wire defects commonly found in SMT and semiconductor manufacturing. Additionally, the system effectively identifies packaging defects, including offsets, wire cross short circuits, flip-chip solder ball problems, wire breakage, and detachment.
NX-E1 | Electronics X-ray Inspection System
The NX-E1 machine is designed for detecting welding defects in electronic components. It specializes in inspecting PCB, SMT assembly, IC packaging, BGA, CSP, semiconductors, etc. Equipped with a sealed X - ray tube (90kV, 200uA) and 85um pixel FPD, it achieves 5um detail resolution for precise defect identification.
NX-E1L | Electronics X-ray Inspection System
The NX-E1L machine serves semiconductor, SMT, DIP, electronic components, IC, BGA, CSP, and flip chip X - ray detection. It has a high - resolution FPD for high - quality images to detect minimum 2um defects, uses CNC programming for automatic positioning with 45° tilt detection, offers real - time navigation imaging and HDR enhancement, and provides measurement tools like size, area, angle, and curvature.
NX-E3 | Electronics X-ray Inspection
The X - Ray machine NX-E3 features a strong - penetrating ray source and HD FPD for universal inspection. With a 70° - tilting detector, 360° - rotating stage, and six - axis linkage for all - round control/detection, it has high - definition navigation images for fast product positioning, plus HDR enhancement and measurement tools like size/area/angular curvature.
NX-E3L | Electronics X-ray Inspection System
The NX-E3L machine serves semiconductor, SMT, DIP, electronic components, IC, BGA, CSP, and flip chip X - ray detection. It has a high - resolution FPD for high - quality images to detect minimum 2um defects, uses CNC programming for automatic positioning with 45° tilt detection, offers real - time navigation imaging and HDR enhancement, and provides measurement tools like size, area, angle, and curvature.
NX-E6LP | Automatic Inline X-ray Inspection System
The X-Ray machine NX-E6LP is used for detecting BGA and chip compon-ents; Nickel plate detection of metal plate andFPC welding parts, calculation of bubble perc.entage, size, area measurement, analysis ofinternal defects such as low tin and virtual soldering in products.The advanced inspection equipment is specifically designed for detecting BGA and chip components, nickel plate detection on metal plates, and FPC welding parts. It efficiently calculates bubble percentages, measures size and area, and analyzes internal defects such as low tin and virtual soldering in products.
NX-EF | Electronics X-ray Inspection System
The NX-EF machine is applied to detect welding defects in electronic components. It is capable of inspecting PCB, SMT assembly, IC packaging, BGA (Ball Grid Array), CSP (Chip Scale Package), semiconductor and other components. With its advanced technology, it can accurately identify various welding issues, ensuring the quality and reliability of electronic products.
