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RO-1000 | Lead Free Reflow Oven
The nectec Ten Temperature zone Ring lead-free reflow Soldering, suitable for one-rail/dual-rail/nitrogen soldering, supporting single-track boards with a maximum width of 511mm or dual-track boards with a width of 411mm×411mm. Equipped with efficient heating system, intelligent transport structure and flexible cooling configuration, compatible with ERP/MES system.
RO-1200 | Lead Free Reflow Oven
Twelve-zone lead-free reflow oven, supports one-rail/dual-rail/nitrogen soldering, one-rail maximum width 561mm, dual-track 411mm×411mm. Equipped with 12 independent temperature control zones, intelligent error-proofing system and fully automatic lubrication device.
RO-4000&RO-5000 | Lead Free Reflow Oven
The Nectec 4/5 Zones Reflow Oven features an economical design with a standard preheating length for efficient PCB soldering. It includes a cooling zone for rapid temperature reduction and a mess conveyor system, supporting PCB widths up to 300mm. With compact dimensions and low power consumption, it's ideal for small-volume production needs.
RO-6000 | Lead Free Reflow Oven
The Nectec 6 Zones Reflow Oven is an affordable solution designed for efficient PCB assembly and soldering. With six temperature zones, it offers precise control over the heating process, ensuring optimal solder joint quality.
RO-8840 | Lead Free Reflow Oven
Eight Temperature zone Ring lead-free reflow Soldering, suitable for one-rail/dual-rail/nitrogen Soldering, supporting single-track boards with a maximum width of 511mm or dual-track boards with a width of 411mm×411mm. Equipped with efficient heating system, intelligent transport structure and flexible cooling configuration, compatible with ERP/MES system.
