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In recent years, with the continued popularization of the concept of smart manufacturing, the development of SMT toward smart factories and smart production has become a consensus. How to achieve high levels of automation and intelligent management of production lines, reduce manual intervention, and improve production efficiency and product quality has become the key focus for manufacturers moving forward. For example, in response to market changes characterized by multiple product varieties and small batch sizes, SMT equipment must possess flexible and efficient manufacturing capabilities, as well as rapid line change capabilities. Modular design, automatic switching of placement heads, and real-time dynamic scheduling systems will become critical to meet the rapid transition between different product specifications and production batches. Solder paste dispensing involves using a solder paste printer to precisely apply solder paste to pre-designed pad locations on a PCB, and it is one of the key technologies in SMT production. Nectec’s SP-510A solder paste printer, which features UVW-axes automatic retractable pressure plates. During production, it not only addresses issues such as mark recognition alarms caused by PCB deformation or unevenness, printing defects caused by PCB deformation or unevenness, but also monitors the internal temperature and humidity of the machine in real-time during operation to ensure an optimal environment for solder paste printing. Additionally, to ensure traceability and diagnostics throughout the process, the solder paste printer is equipped with a camera scanning system and steel mesh aperture detection functionality. At Nectec, we have also developed a range of intelligent manufacturing equipment, including plasma cleaners and dispensing machines, enabling coverage of more production processes in SMT manufacturing. The launch of the ADA Intelligent Platform Series, which standardizes non-standard machinery, marks another breakthrough in our strategy to provide customers with comprehensive intelligent manufacturing solutions.
In addition to individual equipment, Andatech can also offer flexible production solutions tailored for applications in PCBA processing, 3D glass manufacturing, and smartphone assembly. Since the SMT production process involves a long series of steps, equipment innovation at each node can adopt a strategy of further integration with intelligent software systems. For example, our NT-P5’s advanced visual recognition and machine learning algorithms can be integrated to enable equipment to perform autonomous fault diagnosis, self-optimization, and remote maintenance, while also enabling real-time collection and analysis of production data to improve overall production efficiency. Nectec’s NT-L12 is primarily used in the electronic assembly and LED packaging stages of the electronics manufacturing industry. It offers tailored solutions for key challenges such as PCB warpage, stencil warpage, curvature, environmental factors, solder paste formation, and printing capabilities. For example, in terms of expansion and contraction, it employs steel mesh adsorption and alignment compensation functions. For warping, it uses a sealed suction chamber and incorporates technologies such as height detection, automatic height measurement, and scraper pressure feedback. In solder paste forming, it utilizes a real-time pressure closed-loop system and adopts a dual-drive scraper structure. Nectec also offers a range of SMT equipment, including Mini-type selective wave soldering machines, offline selective wave soldering machines, online dual-head selective wave soldering machines, PCBA online water cleaning machines, and offline water cleaning machines. For example, our WS-450 online selective wave soldering machine can be integrated with upstream equipment for continuous production, combining spraying, preheating, and soldering into one unit. It has a small footprint, low energy consumption, and is ideal for high-quality, small-batch, and multi-variety flexible production