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AIMEX III | Flexible Placement Machine
The FUJI AIMEX III placement machine is designed for high-mix production and achieves efficient production with the collaboration of multiple components. Its core components have diverse functions and each system works closely together, greatly improving the flexibility, precision and efficiency of production.
NXT-H | High Accuracy Mounter
NXT-H is a high-end model designed by FUJI for semiconductor and high-density placement scenarios. Its core advantages lie in full compatibility with wafers/reel materials/trays, high-precision low-impact placement, and clean room adaptability. Its modular design combines advanced vision and pressure control technology, making it suitable for complex processes such as SiP modules, power semiconductors, and micro LEDs. It also achieves efficient production management and quality traceability through intelligent software.
NXT-III | Multi-Functional Modular Placing Machine
NXT-3 is a modular placement machine designed by FUJI for multi-variety and high-mix production scenarios. Its core advantages lie in flexible modular architecture, high-precision low-impact placement and intelligent production management. It supports the full range of processing from ultra-small chips to large special-shaped components, combined with advanced visual inspection and error-proofing technology, and is suitable for automotive electronics, mobile devices, semiconductor packaging and other fields with extremely high requirements for precision and efficiency. Through deep integration of software and hardware, it achieves fast changeover, efficient production and full-process quality traceability, and is one of the core equipment of intelligent factories.
NXT-R | High-End Modular Placement Machine
NXT-R takes "zero defects, zero labor, and zero downtime" as its core, and realizes efficient production and high-quality placement of multiple varieties through modular design, intelligent feeding, high-precision placement head and full-process sensor detection. Its core advantages are: Unmanned material management: The intelligent loading vehicle completely liberates the operator and reduces human errors; Full-scenario adaptation: From small chips to large special-shaped components, it is compatible with flexible circuit boards and ceramic substrates; Data-driven quality: LCR detection, 3D coplanarity scanning and other technologies intercept early defects, with a yield rate of more than 99.9%.
