Description

Placement Head System

Multi-Configuration Placement Architecture

• RM Ultra-High-Speed Turret Head (18 Nozzles):
  • Achieves 120,000 CPH peak throughput (IPC-9850 compliant) for 0201 metric (0.25×0.125mm) micro-components up to 12×12×6.5mm (L×W×H).
  • Turret design enables high-speed rotational pickup with integrated vision for real-time component pose detection, supporting dense placement of ultra-small parts without head changeover.
• HM High-Speed In-Line Head (10 Nozzles):
  • Delivers 100,000 CPH for chip components, handling 0201 metric to 55×100×15mm components (BGA, CSP, connectors).
  • Intelligent path planning via embedded scanning camera reduces idle time for medium-to-large component placement.
• FM Odd-Form In-Line Head (5 Nozzles):
  • Supports 03015 metric (0.3×0.15mm) to 55×100×30mm components with force control (0.1–10N), ideal for high-precision connectors and press-fit components.
• Unified Head Platform: Seamlessly transitions from 0201 metric to 100mm components without head change, minimizing changeover time for high-mix production.

Feeder System

Multi-Modal Material Handling

• Reel Feeding:
  • Fixed feeder rack supports 128 stations (8mm tape equivalent), compatible with 8–56mm pneumatic feeders (F1/F2) and 8–88mm electric feeders (F3).
  • AutoLoading Feeders reduce material change time by 30%; ZS/SS smart feeders (YS series compatible) enable offline presetting and continuous feeding.
• Tray Feeding (Optional):
  • eATS30 automatic tray changer supports 30-layer JEDEC-standard trays for non-stop component supply in high-changeover environments.
• Stick Feeding:
  • Single-stick feeders accommodate manual/auto-loading of odd-form components (connectors, heat sinks).
• Flexible Changeover: Supports 4×CFB-45E material carts (128-station max), enabling mixed 新旧 trolley use for multi-variety production.

PCB Processing System

High-Flexibility Substrate Handling

• Size Range:
  • Single-track: 50×50–810×510mm (industrial PCBs)
  • Dual-track: 50×50–810×330mm (parallel processing of mixed/identical boards)
• Dynamic Transmission:
  • 900mm/sec transport speed with laser-guided width adjustment (no mechanical stops), compatible with routed/odd-shaped PCBs.
  • Front-reference clamping ensures ±0.1mm positioning accuracy, preventing placement drift.
• Dual-Track Modes:
  • Parallel: Simultaneous processing of dissimilar boards (e.g., smartphone + automotive PCBs).
  • Alternating: Double throughput with identical board production.
  • Mixed: Flexible combination for complex scheduling.

Vision & Inspection System

Advanced Quality Assurance

• Component Verification:
  • Side-view camera monitors nozzle-tip component pose, detecting missing parts, tombstoning, and skew with ≥99.9% defect rejection rate.
  • Embedded scanning camera achieves <0.1s/component high-speed inspection for ≤12mm components (e.g., BGA).
• Optional Metrology:
  • Coplanarity detection for QFP leads (±15μm accuracy) reduces high-end package (SiP) solder defects.
• Maintenance Integration:
  • Auto nozzle cleaning station removes contaminants; RFID-tracked nozzles auto-flag wear.
  • Real-time negative pressure sensing verifies pickup integrity post-suction.

Motion Control System

Precision Mechanics

• Drive Technology:
  • X/Y axes: AC servo motors + linear guides achieve ±15μm placement accuracy (Cpk≥1.0), ±10μm repeatability for ≤0.3mm pitch components.
  • Laser-measured substrate warpage enables dynamic Z-axis adjustment, limiting impact force to ≤50gf for flex PCBs and micro-components.
• Intelligent Path Optimization:
  • AI-driven shortest-path planning reduces air travel by 20%, enhancing single-board productivity.

Core Systems & Automation

Software & Connectivity

• Production Orchestration:
  • CAD-to-program auto-conversion shortens NPI time by 50%; multi-language HMI (EN/JP/KR/CN) simplifies operation.
  • Yamaha Smart Factory integration enables real-time data upload (placement coordinates, OEE) for automotive-grade traceability.

Hardware Design

• Compact Dual-Track Footprint: 1,374×2,102×1,445mm dimensions with 2,550kg mass optimizes floor space in high-density lines.
• Tool-Less Maintenance: One-touch nozzle bracket replacement; auto-cleaner supports batch maintenance (40% time savings); feeder self-diagnostics with real-time fault alerts.

Automation Features

• Auto-Ejector Adjustment: Program-driven ejector positioning adapts to varying board thickness and component layouts.
• Uninterrupted Material Flow: eATS30 tray feeders + auto-reel changers enable lights-out production for extended runs.