Description

Laser Metrology System (LNC60)

• High-Resolution Laser Profiling: The LNC60 sensor utilizes laser shadow analysis to dynamically measure component position, orientation, and dimensions in real-time. Supports 0603 (0201 imperial) to 33.5mm² components, including QFP and BGA packages, with ±50μm placement accuracy (Cpk≥1.0).
• In-Flight Recognition: Completes component verification during high-speed head transit, minimizing idle time. Side-view imaging mitigates electrode shape/color interference for stable recognition.

Placement Head & Nozzle Engineering

• 6-Nozzle Parallel Placement Head: Single head with 6 independent nozzles enables synchronous pick-and-place, achieving 32,000 CPH theoretical throughput under ideal conditions.
• Threaded Nozzle Technology: Accommodates large components (up to 25mm diameter, e.g., LED lenses) with high-speed interactive pickup. Optimized nozzle materials support micro-component (0603) and high-density placement requirements.

PCB Handling System

• Ultra-Long Substrate Capability: Supports 1,500×360mm extended-length PCBs via multi-segment conveyance (3-stage transfer), ideal for LED panel and LCD backlight production.
• Standard/Extended Form Factors:
  • Single-transfer: 650×360mm
  • Expanded: 1,500×360mm (flex/rigid boards)
• Active Vibration Damping: Motorized support table reduces transport-induced placement deviations.

Feeder System

• Hybrid Feeding Architecture: Supports mixed mechanical/electric feeder configurations, with standard 40-station (8mm tape) capacity expandable to 160 via eFeeder upgrades.
• Cross-Series Compatibility: eFeeders are backward-compatible with JUKI RX/FX/KE series for unified line stability.
• Intelligent Feeding Technology: Auto-splicing and real-time shortage alerts reduce manual intervention.

Motion Control & Drive System

• Dual-Servo Y-Axis Actuation: Optimizes conveyor stability during high-speed operation to maintain placement precision.
• Linear Motor with Magnetic Levitation: Select models feature low-friction, maintenance-free magnetic levitation drives for reduced wear and energy efficiency.

Intelligent Functions & Software

• In-Process Inspection Suite:
  • Pre-placement: Real-time pick verification via HMI to prevent micro-component misplacement.
  • Post-placement: Auto-detection of component standoff and orientation errors to minimize defect rates.
• JaNets Integration: Modular programming supports seamless integration with JUKI’s production management suite for optimized line balancing.

Maintenance & Reliability

• Modular Service Design: Quick-change nozzles and feeders reduce mean time to repair (MTTR).
• Lubrication-Free eFeeders: Low-maintenance design extends equipment lifecycle and reduces daily upkeep.
• CPK Compliance Calibration: Regular glass-fixture-based offset correction ensures long-term process stability.